# US 11,445,603 B2 · Component vertical mounting

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- Number: US 11,445,603 B2
- Document ID: US11445603B2
- Status: Granted
- Kind: B2
- Application number: 16/224,023
- Filed: 2018-12-18
- Published: 2019-04-25
- Granted: 2022-09-13
- Earliest claimed: 2016-10-24
- Assignees: Hamilton Sundstrand Corporation
- Applicants: Hamilton Sundstrand Corporation
- Inventors: David Perley; Kenneth J. Trotman
- Web page: https://patentgrep.com/patent/US11445603B2

## CPC

- H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings}
- H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence)
- H05K 7/02: Arrangements of circuit components or wiring on supporting structure
- H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H05K 13/046: {Surface mounting (surface mounted components H05K3/341)}
- H05K 2201/06: Thermal details
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/10166: Transistor
- H05K 2203/17: Post-manufacturing processes
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

## Claims

### Claim 1

A method of assembling a circuit component arrangement comprising:
temporarily fastening at least one circuit component to a base;
injecting a bonding agent into a respective open channel defined in the base to adhere each of the at least one circuit component to the base; and
removing any fasteners that temporarily fastened the at least one circuit component to the base.

### Claim 2 (depends on 1)

A method as recited in claim 1, wherein injecting a bonding agent includes injecting the bonding agent through an inlet opening into each respective open channel.

### Claim 3 (depends on 1)

A method as recited in claim 1, wherein injecting a bonding agent includes ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.