# US 11,445,602 B2 · Flexible circuit board on bus bars > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,602 B2 - Document ID: US11445602B2 - Status: Granted - Kind: B2 - Application number: 17/260,874 - Filed: 2019-07-12 - Published: 2021-08-26 - Granted: 2022-09-13 - Earliest claimed: 2018-07-18 - Assignees: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd. - Applicants: AutoNetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd. - Inventors: Shungo Hiratani; Shinsuke Okumi; Arinobu Nakamura; Akira Haraguchi; Heng Cao - Web page: https://patentgrep.com/patent/US11445602B2 ## CPC - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H05K 1/181: associated with surface mounted components - H05K 7/04: on conductive chassis - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 2201/068: wherein the coefficient of thermal expansion is important - H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar. ## Claims ### Claim 1 A circuit board including a plurality of conductive pieces that are connected to terminals of a semiconductor element and are provided flush with each other, and an insulation region arranged between the conductive pieces, the circuit board comprising: a first conductive piece to which the semiconductor element is fixed; a conductive sheet that is connected to a second conductive piece via a first connection portion and electrically connects a first terminal of the semiconductor element to the second conductive piece; and a second connection portion that is provided in the conductive sheet and electrically connects the first terminal and the second conductive piece. ### Claim 2 (depends on 1) The circuit board according to claim 1, wherein the conductive sheet includes: a conductive portion that electrically connects the first terminal and the second conductive piece, and an insulation sheet that insulates the conductive portion from at least the first conductive piece; and wherein the second connection portion includes: a recession portion formed such that the conductive portion is exposed therein, and an inner conductive portion that is provided inside the recession portion and electrically connects the conductive portion and the second conductive piece. ### Claim 3 (depends on 1) The circuit board according to claim 1, wherein the second connection portion is provided in a vicinity of the insulation region. ### Claim 4 (depends on 2) The circuit board according to claim 2, wherein the inner conductive portion is an annular portion formed on an inward surface of the recession portion. ### Claim 5 (depends on 2) The circuit board according to claim 2, wherein the inner conductive portion is solder that has been welded to the conductive portion and the second conductive piece. ### Claim 6 (depends on 4) The circuit board according to claim 4, wherein the conductive portion is plate-shaped. ### Claim 7 (depends on 1) The circuit board according to claim 1, wherein the conductive sheet is an FPC (Flexible Printed Circuit). ### Claim 8 (depends on 2) The circuit board according to claim 2, wherein the second connection portion is provided in a vicinity of the insulation region. ### Claim 9 (depends on 5) The circuit board according to claim 5, wherein the conductive portion is plate-shaped. ### Claim 10 (depends on 2) The circuit board according to claim 2, wherein the conductive sheet is an FPC (Flexible Printed Circuit). ### Claim 11 (depends on 3) The circuit board according to claim 3, wherein the conductive sheet is an FPC (Flexible Printed Circuit). ### Claim 12 (depends on 4) The circuit board according to claim 4, wherein the conductive sheet is an FPC (Flexible Printed Circuit). ### Claim 13 (depends on 5) The circuit board according to claim 5, wherein the conductive sheet is an FPC (Flexible Printed Circuit). ### Claim 14 (depends on 6) The circuit board according to claim 6, wherein the conductive sheet is an FPC (Flexible Printed Circuit).