# US 11,445,601 B2 · Component carrier and method of manufacturing a component carrier > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,601 B2 - Document ID: US11445601B2 - Status: Granted - Kind: B2 - Application number: 17/247,832 - Filed: 2020-12-24 - Published: 2021-07-01 - Granted: 2022-09-13 - Earliest claimed: 2019-12-31 - Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Inventors: Mikael Tuominen; Seok Kim Tay - Web page: https://patentgrep.com/patent/US11445601B2 ## CPC - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 70/685: comprising multiple insulating layers - H10W 70/69: Insulating materials thereof - H10W 70/695: Organic materials - H10W 74/114: {by a substrate and the encapsulations} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/09136: Means for correcting warpage - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A component carrier includes a stack having at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure. The first electrically insulating layer structure is made of a material which has first physical properties. The second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties. The first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other. A method of manufacturing a component carrier is also disclosed. ## Claims ### Claim 1 A component carrier, comprising: a stack comprising at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure; wherein the first electrically insulating layer structure is made of a material which has first physical properties; wherein the second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties; wherein the first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other; a component embedded in the stack; wherein the second electrically insulating layer structure directly surrounds at least part of the component; wherein the second electrically insulating layer structure has a shell at least partially surrounding the component. ### Claim 2 (depends on 1) The component carrier according to claim 1, wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a low Young modulus material. ### Claim 3 (depends on 2) The component carrier according to claim 2, wherein the low Young modulus material has a value of the Young modulus below 3 GPa. ### Claim 4 (depends on 1) The component carrier according to claim 1, wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a high Young modulus material. ### Claim 5 (depends on 4) The component carrier according to claim 4, wherein the high Young modulus material has a value of the Young modulus above 3 GPa. ### Claim 6 (depends on 1) The component carrier according to claim 1, wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a low loss material having low loss for high frequencies. ### Claim 7 (depends on 6) The component carrier according to claim 6, wherein the low loss material has a loss factor of not more than 0.004 at a frequency of 1 GHz. ### Claim 8 (depends on 1) The component carrier according to claim 1, wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a low shrinkage material having a curing shrinkage value of less than 1%. ### Claim 9 (depends on 8) The component carrier according to claim 8, comprising at least one of the following features: wherein the low shrinkage material is a high Young modulus material; wherein the other one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a material having a higher curing shrinkage value than 1%. ### Claim 10 (depends on 8) The component carrier according to claim 8, wherein the curing shrinkage value of said material of the first electrically insulating layer structure and/or the second electrically insulating layer structure is measured by: connecting a layer of said material in an uncured condition and with an initial length “A” on a base; curing said layer; determining a length “a” of the cured layer in a cured condition of said material; and calculating the curing shrinkage value as (A−a)/A. ### Claim 11 (depends on 1) The component carrier according to claim 1, wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a highly thermally conductive material. ### Claim 12 (depends on 11) The component carrier according to claim 11, wherein the highly thermally conductive material has a thermal conductivity of at least 1 W/mK. ### Claim 13 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: wherein one of the first electrically insulating layer structure and the second electrically insulating layer structure is made of a high flow material. ### Claim 14 (depends on 13) The component carrier according to claim 13, comprising at least one of the following features: wherein the component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an optical element, a bridge, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip. ### Claim 15 (depends on 14) The component carrier according to claim 14, the first electrically insulating layer structure has two opposing layers sandwiching the component and the second electrically insulating layer structure and extending laterally beyond all sidewalls of the component and/or extending laterally beyond the shell. ### Claim 16 (depends on 15) The component carrier according to claim 15, wherein the shell surrounds all sidewalls of the component and only one or both of two opposing main surfaces of the component. ### Claim 17 (depends on 13) The component carrier according to claim 13, wherein a ratio between a length of the embedded component and a length of the component carrier is at least 30%. ### Claim 18 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: the component carrier is configured as coreless component carrier; the component carrier is configured as rigid component carrier; wherein the first electrically insulating layer structure and the second electrically insulating layer structure are in direct physical contact with each other without any electrically conductive material in between; wherein at least one of the first electrically insulating layer structure and the second electrically insulating their structure is functionalized with at least one of the group consisting of a high thermal conductivity function, a low loss at high frequency function, and a high flow function. ### Claim 19 (depends on 1) The component carrier according to claim 1, comprising at least one of the following features: wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten; wherein at least one of the first electrically insulating layer structure and the second electrically insulating layer structure comprises at least one of the group consisting of reinforced resin, non-reinforced resin, epoxy resin, or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up material, polytetrafluoroethylene, a ceramic, and a metal oxide; wherein the component carrier is shaped as a plate; wherein the component carrier is configured as one of the group consisting of a printed circuit board, and a substrate; wherein the component carrier is configured as a laminate-type component carrier. ### Claim 20 A method of manufacturing a component carrier, comprising: forming a stack comprising at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure; configuring the first electrically insulating layer structure of a material having first physical properties; configuring the second electrically insulating layer structure of another material having second physical properties differing from the first physical properties; arranging the first electrically insulating layer structure and the second electrically insulating layer structure at least partially in direct physical contact with each other; and embedding a component in the stack; wherein the second electrically insulating layer structure directly surrounds at least part of the component; wherein the second electrically insulating layer structure has a shell at least partially surrounding the component.