# US 11,445,597 B2 · Electronic device including connection structure for electrically connecting printed circuit board and housing

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,445,597 B2
- Document ID: US11445597B2
- Status: Granted
- Kind: B2
- Application number: 16/881,399
- Filed: 2020-05-22
- Published: 2020-11-26
- Granted: 2022-09-13
- Earliest claimed: 2019-05-23
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Wonsub Lim; Hyoseok Na; Wanjae Ju
- Web page: https://patentgrep.com/patent/US11445597B2

## CPC

- G06F 1/1698: {the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266)}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module}
- H01Q 1/24: with receiving set
- H01Q 1/243: {with built-in antennas}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01R 4/04: using electrically conductive adhesives
- H01R 12/51: for rigid printed circuits or like structures
- H01R 12/721: {cooperating directly with the edge of the rigid printed circuits}
- H01R 33/02: Single-pole devices, e.g. holder for supporting one end of a tubular incandescent or neon lamp
- H04M 1/0277: {for a printed circuit board assembly}
- H05K 1/0215: {Grounding of printed circuits by connection to external grounding means}
- H05K 5/006: {characterized by features for holding the PCB within the housing}
- H05K 7/1417: {having securing means for mounting boards, plates or wiring boards (H05K7/1461 takes precedence)}
- H05K 9/0039: {Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218)}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means}
- H05K 2201/0314: Elastomeric connector or conductor, e.g. rubber with metallic filler
- H05K 2201/09981: Metallised walls
- H05K 2201/0999: Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed is an electronic device that includes a first cover, a second cover opposite the first cover, a side housing disposed between the first cover and the second cover and including a plate disposed between the first cover and the second cover and a frame surrounding the plate and connected with the first cover and the second cover, a display disposed between the plate and the first cover, and a printed circuit board disposed between the plate and the second cover and including a first surface facing the plate, a second surface facing the second cover, and side surfaces provided between the first surface and the second surface, at least some of the side surfaces including plated areas. The plate includes a connection structure to which the printed circuit board is electrically connected, the connection structure includes a recess, the recess including a first sidewall, a second sidewall facing the first sidewall, a first conductive structure comprising a conductive material disposed on the first sidewall, and a second conductive structure comprising a conductive material disposed on the second sidewall, and at least part of the printed circuit board is disposed in the recess such that the plated areas contact the first conductive structure and the second conductive structure.

## Claims

### Claim 1

An electronic device comprising:
a first cover;
a second cover opposite the first cover;
a side housing disposed between the first cover and the second cover, the side housing including a plate provided between the first cover and the second cover and a frame surrounding the plate and connected with the first cover and the second cover;
a display disposed between the plate and the first cover; and
a printed circuit board disposed between the plate and the second cover, the printed circuit board including a first surface facing the plate, a second surface facing the second cover, and side surfaces between the first surface and the second surface, wherein at least some of the side surfaces include plated areas,
wherein the plate includes a connection structure to which the printed circuit board is electrically connected, the connection structure including a recess, the recess including a first sidewall, a second sidewall facing the first sidewall, a first conductive structure comprising a conductive material disposed on the first sidewall, a second conductive structure comprising a conductive material disposed on the second sidewall, and a bottom surface disposed between the first sidewall and the second sidewall and facing the second cover, and
wherein at least part of the printed circuit board is disposed in the recess such that the plated areas contact the first conductive structure and the second conductive structure, and at least part of the first surface of the printed circuit board is seated on the bottom surface.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein at least one of the first sidewall, the second sidewall, and the bottom surface includes a metal portion electrically connected with a ground area of the printed circuit board through the first conductive structure and the second conductive structure.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein the connection structure further includes a conductive tape disposed on the bottom surface, and
wherein the conductive tape is configured to attach the first surface of the printed circuit board to the bottom surface.

### Claim 4 (depends on 1)

The electronic device of claim 1, wherein the plate includes a metal portion, and
wherein the metal portion is electrically connected with a ground area of the printed circuit board through the first conductive structure and the second conductive structure.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein the printed circuit board includes a plurality of layers including the first surface and the second surface, and
wherein the plurality of layers include a ground area electrically connected with the plated areas.

### Claim 6 (depends on 1)

The electronic device of claim 1,
wherein the first surface of the printed circuit board includes a second plated area contacting the bottom surface and electrically connected with a ground area included in the printed circuit board.

### Claim 7 (depends on 6)

The electronic device of claim 6, wherein the printed circuit board further includes a conductive VIA penetrating from the first surface to the ground area.

### Claim 8 (depends on 1)

The electronic device of claim 1, wherein the first conductive structure and the second conductive structure include an elastic material, and
wherein the first conductive structure and the second conductive structure are configured to press the plated areas of the printed circuit board toward the recess.

### Claim 9 (depends on 1)

The electronic device of claim 1, wherein the connection structure further includes a third sidewall provided between the first sidewall and the second sidewall and a third conductive structure comprising a conductive material disposed on the third sidewall, and
wherein the first conductive structure, the second conductive structure, and the third conductive structure are integrally formed.

### Claim 10 (depends on 1)

The electronic device of claim 1, wherein the printed circuit board includes a first printed circuit board and a second printed circuit board, and
wherein at least one of the first printed circuit board and the second printed circuit board is disposed in the recess.

### Claim 11 (depends on 10)

The electronic device of claim 10, wherein one of the first printed circuit board and the second printed circuit board includes an antenna substrate having an antenna pattern disposed inside or on a surface of the antenna substrate, the antenna substrate being disposed in the recess,
wherein the antenna pattern includes a first antenna pattern configured to radiate electric waves toward the second cover and a second antenna pattern configured to radiate electric waves toward the frame, and
wherein the recess is open in a direction toward the frame.

### Claim 12 (depends on 10)

The electronic device of claim 10, further comprising:
a connecting member comprising a conductor configured to electrically connect the first printed circuit board and the second printed circuit board,
wherein the connecting member includes a flexible printed circuit board (FPCB) and/or a coaxial cable.

### Claim 13 (depends on 1)

The electronic device of claim 1, wherein each of the first conductive structure and the second conductive structure includes a conductive sponge comprising an elastic material and a conductive material.

### Claim 14 (depends on 1)

The electronic device of claim 1, wherein the first conductive structure includes a first protrusion protruding toward the recess from the first sidewall,
wherein the second conductive structure includes a second protrusion protruding toward the recess from the second sidewall, and
wherein the first protrusion and the second protrusion contact the plated areas of the printed circuit board.

### Claim 15

An electronic device comprising:
a housing;
a bracket disposed in the housing, the bracket including a metal portion comprising a metallic material;
a recess including a pair of sidewalls facing each other and a bottom surface disposed between the pair of sidewalls, wherein at least part of the recess is provided on the metal portion of the bracket;
a conductive member comprising a conductive material disposed between the pair of sidewalls of the recess; and
a printed circuit board seated on a surrounding area around the recess facing the bottom surface of the recess, the printed circuit board including a first surface contacting the conductive member and a second surface opposite the first surface,
wherein each of the pair of sidewalls includes a protrusion protruding toward the conductive member, and
the conductive member configured to press the first surface of the printed circuit board while being supported on the bottom surface.

### Claim 16 (depends on 15)

The electronic device of claim 15, including a plurality of protrusions protruding from each of the pair of sidewalls.

### Claim 17 (depends on 15)

The electronic device of claim 15, wherein the protrusions are configured to press at least part of the conductive member.

### Claim 18 (depends on 15)

The electronic device of claim 15, wherein the first surface of the printed circuit board includes a plated area electrically connected with a ground area included in the printed circuit board, and
wherein the plated area contacts the conductive member.

### Claim 19 (depends on 15)

The electronic device of claim 15, wherein the conductive member includes a conductive sponge comprising an elastic material and a conductive material.

### Claim 20 (depends on 15)

The electronic device of claim 15, wherein the recess further includes a pair of second sidewalls connecting the pair of sidewalls and facing each other, and
wherein a second protrusion protruding toward the conductive member is disposed on each of the pair of second sidewalls.