# US 11,445,596 B2 · Circuit board having heat-dissipation block and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,596 B2 - Document ID: US11445596B2 - Status: Granted - Kind: B2 - Application number: 17/153,856 - Filed: 2021-01-20 - Published: 2021-05-13 - Granted: 2022-09-13 - Earliest claimed: 2018-12-27 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: Chin-Sheng Wang; Pei-Chang Huang - Web page: https://patentgrep.com/patent/US11445596B2 ## CPC - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 3/0047: {Drilling of holes} - H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - H05K 2201/10416: Metallic blocks or heatsinks completely inserted in a PCB - H10W 70/682: {comprising holes having chips therein} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion. ## Claims ### Claim 1 A circuit board, comprising: an open substrate having a thickness, comprising: a substrate body having a top surface and a bottom surface; an opening in the substrate body, wherein the opening has a first sidewall and a second sidewall opposite to the first sidewall; at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, wherein the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall and have a height smaller than the thickness of the open substrate, wherein the first fixing portion and the second fixing portion comprise a conductive layer; and an aperture on the first fixing portion and the second fixing portion along a thickness direction of the open substrate; and a heat dissipation block directly clamped between the first fixing portion and the second fixing portion and in contact with the conductive layer, wherein the heat dissipation block includes ceramic or a composite material. ### Claim 2 (depends on 1) The circuit board of claim 1, wherein a bottom portion of the heat dissipation block is tight contact with the first fixing portion and the second fixing portion. ### Claim 3 (depends on 1) The circuit board of claim 1, wherein the aperture has a depth of about 0.2-0.5 of a thickness of the substrate body. ### Claim 4 (depends on 1) The circuit board of claim 1, wherein the top surface of the substrate body is level with a top surface of the heat dissipation block. ### Claim 5 (depends on 1) The circuit board of claim 1, wherein the first fixing portion has a first width protruding from the first sidewall, and the second fixing portion has a second width protruding from the second sidewall, wherein the first width and the second width are in a range of from about 0.05 mm to about 0.5 mm. ### Claim 6 (depends on 1) The circuit board of claim 1, wherein the first fixing portion has at least two first protrusions in contact with the heat dissipation block and at least one first recess located between the first protrusions and the heat dissipation block, and the second fixing portion has at least two second protrusions in contact with the heat dissipation block and at least one second recess located between the second protrusions and the heat dissipation block. ### Claim 7 (depends on 1) The circuit board of claim 1, wherein the open substrate further includes at least one third fixing portion and at least one fourth fixing portion extending from the substrate body toward the opening, and the heat dissipation block is clamped between the third fixing portion and the fourth fixing portion. ### Claim 8 (depends on 1) The circuit board of claim 1, wherein the opening has round corners at both ends of the first sidewall and the second sidewall. ### Claim 9 (depends on 1) The circuit board of claim 1, wherein the heat dissipation block is selected from one of the group consisting of aluminum silicon carbide (AlSiC), tungsten copper alloy (CuW), tungsten molybdenum alloy (CuMo), silicon carbide (SiC), silicon nitride (AlN), beryllia, chemical vapor deposition diamond (CVD diamond), diamond powder-doped copper, diamond powder-doped aluminum, carbon-based nano-aluminum composite material (CarbAl-N) and carbon-based nano-aluminum composite material (CarbAl-G).