# US 11,445,595 B2 · Airwaves-passing-type heat dissipation sheet and communication module comprising same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,595 B2 - Document ID: US11445595B2 - Status: Granted - Kind: B2 - Application number: 16/982,157 - Filed: 2019-03-26 - Published: 2021-01-28 - Granted: 2022-09-13 - Earliest claimed: 2018-03-27 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Yeo Eun Yoon; Seok Bae - Web page: https://patentgrep.com/patent/US11445595B2 ## CPC - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - C08K 3/38: Boron-containing compounds - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - C08K 2003/385: {Binary compounds of nitrogen with boron} - H05K 2201/0245: Flakes, flat particles or lamellar particles - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 μm, a D10 of 10 to 25 μm, and a D90 of 75 to 85 μm, and the θ50 of the flat boron nitride is arranged to form an angle of 40° or less with horizontal components of the sheet layer. ## Claims ### Claim 1 A communication module comprising: a printed circuit board; an antenna unit and an electronic component disposed on the printed circuit board; and a sheet layer disposed on the antenna unit and the electronic component, wherein the sheet layer includes a polymer resin of 5 to 35 wt % and flat boron nitride particles of 65 to 95 wt %, the flat boron nitride particle have an average particle size of 40 to 50 μm, D10 of the flat boron nitride particles is 15 to 25 μm, and D90 of the flat boron nitride particles is 75 to 85 μm, and the flat boron nitride particles have an angle θ50 of 40° or less with respect to a horizontal component of the sheet layer. ### Claim 2 (depends on 1) The communication module of claim 1, wherein the antenna unit and the electronic component disposed on the printed circuit board is disposed to face the sheet layer. ### Claim 3 (depends on 2) The communication module of claim 2, further comprising a cover layer disposed to cover an upper face and a side face of the printed circuit board on which the antenna unit and the electronic component are disposed, wherein the sheet layer is disposed in contact with one face of the cover layer. ### Claim 4 (depends on 3) The communication module of claim 3, wherein the one face of the cover layer is a face disposed in an inner space for accommodating the antenna unit, the electronic component and the printed circuit board. ### Claim 5 (depends on 4) The communication module of claim 4, wherein an area of the one face of the cover layer is larger than an area of the sheet layer. ### Claim 6 (depends on 1) The communication module of claim 1, wherein the sheet layer is spaced apart from the antenna unit and the electronic component. ### Claim 7 (depends on 1) The communication module of claim 1, wherein the angle θ50 of the flat boron nitride particles is an angle of 20° or less with respect to the horizontal component of the sheet layer. ### Claim 8 (depends on 1) The communication module of claim 1, wherein the sheet layer has a thickness of 100 to 700 μm. ### Claim 9 (depends on 1) The communication module of claim 1, wherein the polymer resin includes an epoxy compound modified with butadiene rubber. ### Claim 10 (depends on 9) The communication module of claim 9, wherein the butadiene rubber includes butadiene acrylonitrile rubber or carboxyl terminated butadiene acrylonitrile (CTBN) rubber. ### Claim 11 (depends on 1) The communication module of claim 1, wherein the sheet layer has a horizontal thermal conductivity of 5 W/mK or more, and the horizontal thermal conductivity is three times or more than a vertical thermal conductivity of the sheet layer. ### Claim 12 (depends on 11) The communication module of claim 11, wherein the horizontal thermal conductivity of the sheet layer is greater than or equal to 15 W/mK and is ten times or more than the vertical thermal conductivity, and the sheet layer has a loss tangent Δ of 0.05% or less at 29 GHz and 1% or less at 39 GHz. ### Claim 13 (depends on 1) The communication module of claim 1, wherein the electronic component and the antenna unit are sequentially disposed on the printed circuit board, or the antenna unit and the electronic component are sequentially disposed on the printed circuit board. ### Claim 14 (depends on 1) The communication module of claim 1, wherein the electronic component is disposed on the printed circuit board and on one side face of the antenna unit. ### Claim 15 (depends on 14) The communication module of claim 14, wherein a separation distance between the electronic component and the antenna unit is less than or equal to 5 mm. ### Claim 16 (depends on 1) The communication module of claim 1, further comprising a protective layer disposed on one face or both faces of the sheet layer. ### Claim 17 (depends on 16) The communication module of claim 16, wherein the protective layer includes an extension portion extending further than a side face of the sheet layer. ### Claim 18 (depends on 16) The communication module of claim 16, wherein a thickness of the protective layer is 0.001 to 0.1 times a thickness of the sheet layer. ### Claim 19 A sheet layer comprising: a polymer resin; and flat boron nitride particles bonded to the polymer resin, wherein the content of the polymer resin is 5 to 35 wt %, the content of the flat boron nitride particles is 60 to 95 wt %, the flat boron nitride particles have an average particle size of 40 to 50 μm, D10 of the flat boron nitride particles is 15 to 25 μm, and D90 of the flat boron nitride particles is 75 to 85 μm, and the flat boron nitride particles have an angle θ50 of 40° or less with respect to a horizontal component of the sheet layer. ### Claim 20 (depends on 19) The sheet layer of claim 19, wherein the polymer resin includes an epoxy compound modified with butadiene rubber.