# US 11,445,096 B1 · Holder on glass imaging module

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- Number: US 11,445,096 B1
- Document ID: US11445096B1
- Status: Granted
- Kind: B1
- Application number: 17/308,048
- Filed: 2021-05-05
- Granted: 2022-09-13
- Earliest claimed: 2021-05-05
- Assignees: Meta Platforms Technologies, LLC
- Applicants: Meta Platforms Technologies, LLC
- Inventors: Andrew Matthew Bardagjy; Likai Li
- Web page: https://patentgrep.com/patent/US11445096B1

## CPC

- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

Coverglass is disposed over an image sensor. The coverglass includes a trench extending a depth into the coverglass. The trench is configured to receive a lens assembly and the lens assembly may be bonded to the trench.

## Claims

### Claim 1

A camera assembly comprising:
an image sensor for imaging incident image light;
a lens assembly including a first optical element; and
coverglass disposed between the image sensor and the lens assembly, wherein the coverglass includes a trench, and wherein a bottom of the lens assembly is configured to align with the trench and be bonded to the trench to reduce a z-height between the image sensor and a first optical element of the lens assembly.

### Claim 2 (depends on 1)

The camera assembly of claim 1, wherein the trench has a depth that is a portion of a thickness of the coverglass.

### Claim 3 (depends on 1)

The camera assembly of claim 1, wherein the trench is keyed to align the lens assembly with the image sensor.

### Claim 4 (depends on 1)

The camera assembly of claim 1 further comprising:
an optical layer disposed on the coverglass between the lens assembly and the coverglass, wherein the trench extends through the optical layer.

### Claim 5 (depends on 1)

The camera assembly of claim 1, wherein the trench is disposed on an outside boundary of the coverglass.

### Claim 6 (depends on 1)

The camera assembly of claim 1, wherein the trench has two sidewalls.

### Claim 7 (depends on 1)

The camera assembly of claim 1, wherein the lens assembly is bonded to the trench.

### Claim 8 (depends on 1)

The camera assembly of claim 1 further comprising:
adhesive-reservoirs extending into the coverglass, wherein the adhesive-reservoirs are configured to accept excess adhesive flowing from the trench.

### Claim 9 (depends on 8)

The camera assembly of claim 8 further comprising:
channels extending into the coverglass to guide the excess adhesive to the adhesive-reservoirs.

### Claim 10 (depends on 9)

The camera assembly of claim 9, wherein the channels are shallower than a depth of the trench and the adhesive-reservoirs have a reservoir-depth that is deeper than the channels.

### Claim 11 (depends on 1)

The camera assembly of claim 1, wherein the lens assembly includes a plurality of optical elements.

### Claim 12 (depends on 1)

The camera assembly of claim 1 further comprising:
adhesive disposed at a bottom of the trench, wherein the adhesive bonds the lens assembly to the trench.

### Claim 13 (depends on 1)

The camera assembly of claim 1, wherein the bottom of the trench has a surface roughness greater than a roughness of the coverglass.

### Claim 14 (depends on 1)

The camera assembly of claim 1, wherein the trench is etched in the coverglass.

### Claim 15 (depends on 1)

The camera assembly of claim 1, wherein the trench has a depth into the coverglass between 50 microns and 400 microns.

### Claim 16

An image sensor module comprising:
an image sensor for imaging incident image light; and
coverglass disposed over the image sensor, wherein the coverglass includes a trench extending a depth into the coverglass, and wherein the trench is configured to receive an assembly body of a lens assembly.

### Claim 17 (depends on 16)

The image sensor module of claim 16 further comprising:
an optical layer disposed on the coverglass, wherein the trench extends through the optical layer.

### Claim 18 (depends on 16)

The image sensor module of claim 16, wherein the trench is disposed on an outside boundary of the coverglass.

### Claim 19 (depends on 16)

The image sensor module of claim 16, wherein the trench has two sidewalls, and wherein the trench is offset from an outside boundary of the coverglass.

### Claim 20 (depends on 16)

The image sensor module of claim 16, wherein the trench is formed over the image sensor, but not over an image pixel array of the image sensor.