# US 11,445,092 B2 · Camera module

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- Number: US 11,445,092 B2
- Document ID: US11445092B2
- Status: Granted
- Kind: B2
- Application number: 16/812,387
- Filed: 2020-03-09
- Published: 2021-04-08
- Granted: 2022-09-13
- Earliest claimed: 2019-10-08
- Assignees: Chicony Electronics Co., Ltd.
- Applicants: Chicony Electronics Co., Ltd.
- Inventors: Wei-Cheng Chen; Tsung-You Wang
- Web page: https://patentgrep.com/patent/US11445092B2

## CPC

- H04N 23/52: Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.

## Claims

### Claim 1

A camera module, comprising:
a circuit board having a surface;
an image sensor disposed on the surface;
a lens holder disposed on the surface and having an inner space;
a filter removable switch located over the surface;
a camera lens on a light-sensing path of the image sensor; and
a thermally conductive structure contacted between the circuit board and the filter removable switch and having a channel, wherein the image sensor is located in the channel and the thermally conductive structure is located in the inner space of the lens holder, and an outer side surface of the thermally conductive structure and an inner side surface of the lens holder face each other and are spaced apart from each other.

### Claim 2 (depends on 1)

The camera module of claim 1, wherein the thermally conductive structure is at least partially compressible.

### Claim 3 (depends on 2)

The camera module of claim 2, wherein the thermally conductive structure has two contacting surfaces respectively contacting the circuit board and the filter removable switch, and the two contacting surfaces are compressible.

### Claim 4 (depends on 1)

The camera module of claim 1, wherein the thermally conductive structure comprises at least one thermal pad.

### Claim 5 (depends on 4)

The camera module of claim 4, wherein a number of the at least one thermal pad is two, and the two thermal pads respectively contact the circuit board and the filter removable switch.

### Claim 6 (depends on 5)

The camera module of claim 5, wherein the two thermal pads are compressible.

### Claim 7 (depends on 5)

The camera module of claim 5, wherein the thermally conductive structure further comprises a metal block contacted between the two thermal pads, and the channel runs through the two thermal pads and the metal block.

### Claim 8 (depends on 7)

The camera module of claim 7, wherein a thickness of the metal block is greater than a thickness of each of the thermal pads.

### Claim 9 (depends on 7)

The camera module of claim 7, wherein a thermal conductivity of the metal block is greater than a thermal conductivity of each of the thermal pads.

### Claim 10 (depends on 1)

The camera module of claim 1, wherein the thermally conductive structure comprises:
a metal block thermally connected between the circuit board and the filter removable switch and having an inner wall surface forming at least a part of the channel; and
a light absorption layer completely coated on the inner wall surface.

### Claim 11 (depends on 1)

The camera module of claim 1, wherein the filter removable switch comprises a metal plate, and the filter removable switch contacts the thermally conductive structure with the metal plate.

### Claim 12 (depends on 1)

The camera module of claim 1, wherein the circuit board further has a metal circuit layer partially exposed from the surface of the circuit board and contacting the thermally conductive structure.

### Claim 13 (depends on 12)

The camera module of claim 12, wherein a portion of the metal circuit layer exposed from the surface of the circuit board has a closed ring shape.