# US 11,444,365 B2 · Radio-frequency (RF)-interface and modular plate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,365 B2 - Document ID: US11444365B2 - Status: Granted - Kind: B2 - Application number: 16/822,399 - Filed: 2020-03-18 - Published: 2021-09-23 - Granted: 2022-09-13 - Earliest claimed: 2020-03-18 - Assignees: Raytheon Company - Applicants: Raytheon Company - Inventors: James Benedict; Erika Klek; John P. Haven; Michael Souliotis; Thomas V. Sikina; Andrew R. Southworth; Kevin Wilder - Web page: https://patentgrep.com/patent/US11444365B2 ## CPC - H01P 5/028: {between strip lines} - H01P 5/085: {Coaxial-line/strip-line transitions} - H01P 3/081: {Microstriplines} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 3/363: {by soldering} - H05K 2201/0397: Tab - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface. ## Claims ### Claim 1 A radio frequency (RF) assembly, comprising: an RF panel comprising a microstrip interface, the microstrip interface comprising a ground-signal configuration; a plate comprising a stripline interface, the stripline interface comprising a ground-signal-ground configuration; a microstrip-to-stripline transition element, which comprises a ground-signal-ground configuration that is curvilinear, operably connectable to the microstrip interface and to the stripline interface; and an additional chip element interposed between an upper surface of the RF panel and a lower surface of the plate, wherein: the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces, an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and the ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel. ### Claim 2 (depends on 1) The RF assembly according to claim 1, wherein: the ground-signal configuration of the microstrip interface is characterized in that dielectric material insulates a signal conductor from a ground conductor and the ground conductor extends along an upper surface of the RF panel, the ground-signal-ground configuration of the stripline interface is characterized in that dielectric material insulates a signal conductor from ground conductors along a lower surface of the plate, and the ground-signal-ground configuration of the microstrip-to-stripline transition element is similar to that of the stripline interface with the upper ground conductor terminating at the microstrip interface. ### Claim 3 (depends on 2) The RF assembly according to claim 2, wherein: the stripline interface is longitudinally interposed between a longitudinal end of the microstrip-to-stripline transition element and a chip element at the lower surface of the plate. ### Claim 4 (depends on 1) The RF assembly according to claim 1, further comprising a printed circuit board (PCB) on which the RF panel is disposed. ### Claim 5 (depends on 1) The RF assembly according to claim 1, wherein the plate comprises at least one of a structural plate and a thermal plate. ### Claim 6 (depends on 1) The RF assembly according to claim 1, further comprising at least one of a chip element at the stripline interface and additional chip elements interposed between the RF panel and the plate. ### Claim 7 (depends on 1) The RF assembly according to claim 1, further comprising at least one of: fastening elements coupled to the RF panel and the plate to apply a compressive force to the microstrip-to-stripline transition element; and solder applied to at least a mechanical interface of the RF panel and the microstrip-to-stripline transition element. ### Claim 8 A radio frequency (RF) assembly, comprising: an RF panel having an upper surface and comprising a microstrip interface at the upper surface; a plate having a lower surface and comprising a stripline interface at the lower surface; a microstrip-to-stripline transition element, which has a ground-signal-ground configuration which is curvilinear, having first and second ends and being operably connected at the first end thereof to the microstrip interface at the upper surface of the RF panel and at the second end thereof to the stripline interface at the lower surface of the plate; and an additional chip element interposed between the upper surface of the RF panel and the lower surface of the plate, wherein: the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces, an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and the ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel. ### Claim 9 (depends on 8) The RF assembly according to claim 8, wherein: the ground-signal configuration of the microstrip interface is characterized in that dielectric material insulates a signal conductor from a ground conductor and the ground conductor extends along the upper surface of the RF panel, the ground-signal-ground configuration of the stripline interface is characterized in that dielectric material insulates a signal conductor from ground conductors along the lower surface of the plate, and the ground-signal-ground configuration of the microstrip-to-stripline transition element is similar to that of the stripline interface with the upper ground conductor terminating at the microstrip interface. ### Claim 10 (depends on 9) The RF assembly according to claim 9, wherein: the stripline interface is longitudinally interposed between a longitudinal end of the microstrip-to-stripline transition element and a chip element at the lower surface of the plate. ### Claim 11 (depends on 8) The RF assembly according to claim 8, further comprising a printed circuit board (PCB) on which the RF panel is disposed. ### Claim 12 (depends on 8) The RF assembly according to claim 8, wherein the plate comprises at least one of a structural plate and a thermal plate. ### Claim 13 (depends on 8) The RF assembly according to claim 8, further comprising at least one of a chip element at the microstrip interface and additional chip elements interposed between the RF panel and the plate. ### Claim 14 (depends on 8) The RF assembly according to claim 8, further comprising at least one of: fastening elements coupled to the RF panel and the plate to apply a compressive force to the microstrip-to-stripline transition element; and solder applied to at least a mechanical interface of the RF panel and the microstrip-to-stripline transition element. ### Claim 15 A radio frequency (RF) assembly, comprising: an RF panel having an upper surface and comprising a microstrip interface at the upper surface; a plate having a lower surface and comprising a stripline interface at the lower surface; and a microstrip-to-stripline transition element comprising: a first end operably connected to the microstrip interface at the upper surface of the RF panel; a second end operably connected to the stripline interface at the lower surface of the plate; a section which has a ground-signal-ground configuration that is curvilinear and which is connected to the first and second ends; and an additional chip element interposed between the upper surface of the RF panel and the lower surface of the plate, wherein: the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces, an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and a ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel. ### Claim 16 (depends on 15) The radio frequency (RF) assembly according to claim 15, wherein the curvilinear section curves downwardly from the first end and upwardly to the second end.