# US 11,444,255 B2 · Method of manufacturing display device, display device, display module, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,255 B2 - Document ID: US11444255B2 - Status: Granted - Kind: B2 - Application number: 16/611,503 - Filed: 2018-05-11 - Published: 2020-04-02 - Granted: 2022-09-13 - Earliest claimed: 2017-05-18 - Assignees: Semiconductor Energy Laboratory Co., Ltd. - Applicants: Semiconductor Energy Laboratory Co., Ltd. - Inventors: Takaaki Nagata; Tatsuya Sakuishi; Kohei Yokoyama; Yasuhiro Jinbo; Taisuke Kamada; Akihiro Chida - Web page: https://patentgrep.com/patent/US11444255B2 ## CPC - H10K 59/131: Interconnections, e.g. wiring lines or terminals - G09F 9/00: Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements (in which the variable information is permanently attached to a movable support G09F11/00; abacus G06C1/00; slide-rules G06G1/00) - G09F 9/30: in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) - H05B 33/04: Sealing arrangements {, e.g. against humidity} - H05B 33/06: Electrode terminals - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H05B 33/12: Light sources with substantially two-dimensional [2D] radiating surfaces - H05B 33/22: characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers - H05K 1/189: characterised by the use of flexible or folded printed circuits - H10K 59/1201: {Manufacture or treatment} - H10K 59/873: {Encapsulations} - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 71/166: {using selective deposition, e.g. using a mask} - H10K 71/80: using temporary substrates - H10K 77/111: {Flexible substrates} - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - H05K 2201/10128: Display - H10K 59/38: comprising colour filters or colour changing media [CCM] - H10K 2102/311: {Flexible OLED} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode. ## Claims ### Claim 1 A method for manufacturing a display device comprising: forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming, over the inorganic insulating layer, a display element to be overlapped with the first portion; forming, over the inorganic insulating layer, a connection electrode to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode. ### Claim 2 (depends on 1) The method for manufacturing a display device according to claim 1, wherein the substrate has a stacked-layer structure of a flexible substrate and a protective layer, wherein the flexible substrate is positioned closer to the inorganic insulating layer than the protective layer is, and wherein the flexible substrate and the protective layer are separated from each other after the connection electrode is exposed. ### Claim 3 (depends on 1) The method for manufacturing a display device according to claim 1, wherein by a dry etching method, the second portion is etched and a sidewall including a reaction product is formed on a side surface of the substrate. ### Claim 4 (depends on 1) The method for manufacturing a display device according to claim 1, wherein the display element is a light-emitting element including a light-emitting organic compound. ### Claim 5 (depends on 1) The method for manufacturing a display device according to claim 1, wherein the separation layer comprises a resin or tungsten. ### Claim 6 A method for manufacturing a display device comprising: forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming, over the inorganic insulating layer, a transistor and a display element electrically connected to the transistor to be overlapped with the first portion; forming, over the inorganic insulating layer, a connection electrode to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode. ### Claim 7 (depends on 6) The method for manufacturing a display device according to claim 6, wherein the connection electrode is formed using a material and a process which are the same as those of at least one of electrodes included in the transistor. ### Claim 8 (depends on 6) The method for manufacturing a display device according to claim 6, wherein the transistor comprises a metal oxide in a semiconductor layer. ### Claim 9 (depends on 6) The method for manufacturing a display device according to claim 6, wherein the transistor comprises silicon in a semiconductor layer.