# US 11,444,227 B2 · Light emitting diode package with substrate configuration having enhanced structural integrity > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,227 B2 - Document ID: US11444227B2 - Status: Granted - Kind: B2 - Application number: 16/686,730 - Filed: 2019-11-18 - Published: 2021-04-01 - Granted: 2022-09-13 - Earliest claimed: 2019-10-01 - Assignees: Dominant Opto Technologies Sdn Bhd. - Applicants: Tek Beng Low; Eng Wah Tan; Chee Sheng Lim - Inventors: Tek Beng Low; Eng Wah Tan; Chee Sheng Lim - Web page: https://patentgrep.com/patent/US11444227B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8506: {Containers} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A light emitting diode package including: a housing, wherein the housing has a first axis defined as a width (w), and a second axis defined as a height (h); a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; wherein the first electrode and the second electrode are spaced apart from each other to define an inter-digit region therebetween, wherein the inter-digit region comprises a length (l) that is offset (e.g., not parallel) relative to the width and/or height of the housing. ## Claims ### Claim 1 A light emitting diode package, comprising: a housing, wherein the housing comprises a first axis defined as a width, and a second axis defined as a height; a lead frame positioned at least partially within the housing, wherein the lead frame comprises a first electrode and a second electrode; wherein a portion of the first electrode and a portion of the second electrode within the housing are spaced apart from each other to define an inter-digit region therebetween, and wherein the inter-digit region is within the housing and comprises a length; and wherein the length of the inter-digit region is offset relative to at least one of the width and the height of the housing. ### Claim 2 (depends on 1) The light emitting diode package according to claim 1, wherein the length of the inter-digit region comprises a single-step configuration. ### Claim 3 (depends on 1) The light emitting diode package according to claim 1, wherein the length of the inter-digit region comprises a double-step configuration. ### Claim 4 (depends on 1) The light emitting diode package according to claim 1, wherein the length of the inter-digit region comprises a multi-step configuration. ### Claim 5 (depends on 1) The light emitting diode package according to claim 1, wherein the first electrode comprises an anode. ### Claim 6 (depends on 1) The light emitting diode package according to claim 1, wherein the second electrode comprises a cathode. ### Claim 7 (depends on 1) The light emitting diode package according to claim 1, wherein the first electrode comprises a pair of anodes. ### Claim 8 (depends on 1) The light emitting diode package according to claim 1, wherein the second electrode comprises a pair of cathodes. ### Claim 9 (depends on 1) The light emitting diode package according to claim 1, wherein the area of the first electrode and the area of the second electrode are not equal. ### Claim 10 (depends on 1) The light emitting diode package according to claim 1, wherein the area of the first electrode is at least two times greater than the area of the second electrode. ### Claim 11 (depends on 1) The light emitting diode package according to claim 1, wherein the area of the first electrode is at least three times greater than the area of the second electrode. ### Claim 12 (depends on 1) The light emitting diode package according to claim 1, wherein the area of the first electrode is at least five times greater than the area of the second electrode. ### Claim 13 A light emitting diode package, comprising: a housing, wherein the housing comprises a first axis defined as a width, and a second axis defined as a height; a lead frame positioned at least partially within the housing, wherein the lead frame comprises a first electrode and a second electrode; wherein a portion of the first electrode and a portion of the second electrode within the housing are spaced apart from each other to define an inter-digit region therebetween, and wherein the inter-digit region is within the housing and comprises a length; wherein the length of the inter-digit region is offset relative to at least one of the width and the height of the housing; and an inter-digit configuration formed by the first electrode and the second electrode for increasing the structural integrity of the light emitting diode package. ### Claim 14 (depends on 13) The light emitting diode package according to claim 13, wherein the structural integrity of the light emitting diode package is at least approximately 25% percent greater than a light emitting diode package having a parallel inter-digit configuration. ### Claim 15 (depends on 13) The light emitting diode package according to claim 13, wherein the structural integrity of the light emitting diode package is at least approximately 50% percent greater than a light emitting diode package having a parallel inter-digit configuration. ### Claim 16 (depends on 13) The light emitting diode package according to claim 13, wherein the structural integrity of the light emitting diode package is at least approximately 100% percent greater than a light emitting diode package having a parallel inter-digit configuration. ### Claim 17 (depends on 13) The light emitting diode package according to claim 13, wherein the structural integrity of the light emitting diode package is at least approximately 150% percent greater than a light emitting diode package having a parallel inter-digit configuration.