# US 11,444,225 B2 · Light emitting diode package having a protective coating

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- Number: US 11,444,225 B2
- Document ID: US11444225B2
- Status: Granted
- Kind: B2
- Application number: 17/013,985
- Filed: 2020-09-08
- Published: 2022-03-10
- Granted: 2022-09-13
- Earliest claimed: 2020-09-08
- Assignees: Dominant Opto Technologies Sdn Bhd.
- Applicants: Tek Beng Low; Chee Sheng Lim
- Inventors: Tek Beng Low; Chee Sheng Lim
- Web page: https://patentgrep.com/patent/US11444225B2

## CPC

- H10H 20/852: Encapsulations
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/853: characterised by their shape
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8506: {Containers}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A light emitting diode package, including: a housing, wherein the housing includes a top section having an aperture; a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; a light emitting diode light source, wherein the light emitting diode light source is associated with the aperture of the housing; an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source and the housing; and a protective coating associated with at least a portion of the encapsulant and the housing, wherein the protective coating reduces and/or eliminates oxidative degradation, thermal degradation, and/or photodegradation.

## Claims

### Claim 1

A light emitting diode package, comprising:
a lead frame, wherein the lead frame comprises a first electrode and a second electrode;
a light emitting diode light source;
an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source;
a protective coating associated with at least a portion of the encapsulant, wherein the protective coating ranges in thickness from 1 micron to 25 microns, and wherein the protective coating comprises an oxygen permeability of less than 500 cc/m2/day, and wherein the protective coating comprises a light transmissivity of at least 75%;
wherein the light emitting diode package is void of a housing; and
wherein a secondary protective coating is positioned on top of the protective coating.

### Claim 2 (depends on 1)

The light emitting diode package according to claim 1, wherein the protective coating covers a top surface of the encapsulant.

### Claim 3 (depends on 1)

The light emitting diode package according to claim 1, wherein the protective coating is thin and translucent and/or transparent.

### Claim 4 (depends on 1)

The light emitting diode package according to claim 1, wherein the protective coating comprises a UV and/or heated cured silicone resin.

### Claim 5 (depends on 1)

The light emitting diode package according to claim 1, wherein the protective coating comprises an epoxy resin and/or any form of a silicone system.