# US 11,444,220 B2 · Light detection device and method for manufacturing light detection device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,220 B2 - Document ID: US11444220B2 - Status: Granted - Kind: B2 - Application number: 17/257,090 - Filed: 2019-06-07 - Published: 2021-06-17 - Granted: 2022-09-13 - Earliest claimed: 2018-07-11 - Assignees: Hamamatsu Photonics K.K. - Applicants: Hamamatsu Photonics K.K. - Inventors: Masaru Morishita - Web page: https://patentgrep.com/patent/US11444220B2 ## CPC - H10F 39/804: {Containers or encapsulations} - H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices - H10F 39/199: {Back-illuminated image sensors} - H10F 77/14: Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A method for producing a light detection device includes preparing a back-illuminated light receiving element that includes a plurality of light receiving sections and a trench which is open to a first main surface so as to isolate the adjacent light receiving sections from each other; disposing the light receiving element on a wiring substrate such that the first main surface of the light receiving element faces the wiring substrate; forming a resin mold, which reaches at least a position that is further away from the wiring substrate than an end portion on a second main surface side of the trench in a thickness direction of the wiring substrate, on the wiring substrate so as to surround an entire side surface of the light receiving element; polishing the light receiving element and the resin mold from the second main surface side of the light receiving element. ## Claims ### Claim 1 A method for producing a light detection device, the method comprising: a first step of preparing a back-illuminated light receiving element that includes a plurality of light receiving sections arranged one-dimensionally or two-dimensionally, a first main surface in which the light receiving sections are formed, and a second main surface opposite to the first main surface, and is provided with a trench which is open to the first main surface so as to isolate adjacent light receiving sections from each other; a second step of disposing the light receiving element on a wiring substrate such that the first main surface of the light receiving element faces the wiring substrate, and electrically and physically connecting a plurality of electrode pads provided on the first main surface and a plurality of electrode pads provided on the wiring substrate; a third step of forming a resin mold, which reaches at least a position that is further away from the wiring substrate than an end portion on a second main surface side of the trench in a thickness direction of the wiring substrate, on the wiring substrate so as to surround an entire side surface of the light receiving element; and a fourth step of polishing the light receiving element and the resin mold from a second main surface side of the light receiving element. ### Claim 2 (depends on 1) The method for producing a light detection device according to claim 1, wherein the first step includes a step of forming the trench by dry etching or wet etching. ### Claim 3 (depends on 1) The method for producing a light detection device according to claim 1, wherein the light receiving element prepared in the first step is divided into a plurality of blocks each having the light receiving section by the trench, and the light receiving element is provided with a dummy block that does not include the light receiving section so as to face the block located on an outermost side in an arrangement direction of the plurality of blocks via the trench in the arrangement direction. ### Claim 4 (depends on 1) The method for producing a light detection device according to claim 1, wherein the plurality of light receiving sections are one-dimensionally arranged, and the trench extends in a direction intersecting an arrangement direction of the plurality of light receiving sections. ### Claim 5 (depends on 1) The method for producing a light detection device according to claim 1, wherein in the third step, the resin mold is formed so as to reach at least a height position of the second main surface of the light receiving element. ### Claim 6 (depends on 1) The method for producing a light detection device according to claim 1, wherein in the third step, the resin mold is formed of a resin material having a Shore hardness of Shore A80 or more or Shore D30 or more. ### Claim 7 (depends on 1) The method for producing a light detection device according to claim 1, wherein in the fourth step, the light receiving element and the resin mold are polished at least up to the trench. ### Claim 8 (depends on 1) The method for producing a light detection device according to claim 1, further comprising: a step of forming a covering portion covering polished surfaces of the light receiving element and the resin mold after the fourth step. ### Claim 9 A light detection device comprising: a wiring substrate; a back-illuminated light receiving element that includes a plurality of light receiving sections arranged one-dimensionally or two-dimensionally, a first main surface in which the light receiving sections are formed, and a second main surface opposite to the first main surface, and is disposed on the wiring substrate such that the first main surface faces the wiring substrate; and a resin mold formed on the wiring substrate so as to surround an entire side surface of the light receiving element, wherein the light receiving element is divided into a plurality of blocks by a gap that is provided from the first main surface to the second main surface so as to isolate adjacent light receiving sections from each other, or by a trench that is open to the first main surface so as to isolate the adjacent light receiving sections from each other, a width of the resin mold from a side surface of the light receiving element to an outer side surface of the resin mold is larger than a width of the gap or the trench, and a plurality of electrode pads provided on the first main surface and a plurality of electrode pads provided on the wiring substrate are electrically and physically connected. ### Claim 10 (depends on 9) The light detection device according to claim 9, wherein the light receiving element is provided with a dummy block that does not include the light receiving section so as to face the block located on an outermost side in an arrangement direction of the plurality of blocks via the gap or the trench in the arrangement direction. ### Claim 11 (depends on 9) The light detection device according to claim 9, wherein the plurality of light receiving sections are one-dimensionally arranged, and the gap or the trench extends in a direction intersecting an arrangement direction of the plurality of light receiving sections. ### Claim 12 (depends on 9) The light detection device according to claim 9, wherein the resin mold is formed of a resin material having a Shore hardness of Shore A80 or more or Shore D30 or more. ### Claim 13 (depends on 9) The light detection device according to claim 9, further comprising: a covering portion covering surfaces of the light receiving element and the resin mold on a second main surface side of the light receiving element.