# US 11,444,061 B2 · Semiconductor memory device and method for driving the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,061 B2 - Document ID: US11444061B2 - Status: Granted - Kind: B2 - Application number: 17/161,907 - Filed: 2021-01-29 - Published: 2022-01-27 - Granted: 2022-09-13 - Earliest claimed: 2020-07-22 - Assignees: Kioxia Corporation - Applicants: Kioxia Corporation - Inventors: Takuro Okubo; Hidekazu Hayashi - Web page: https://patentgrep.com/patent/US11444061B2 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 90/00: Package configurations - H10W 20/023: {the interconnections being through-semiconductor vias} - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 80/00: Direct bonding of chips, wafers or substrates - H10W 80/312: {characterised by the direct bonding of electrically conductive pads} - H10W 80/327: {characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers} - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/792: {between multiple chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A manufacturing method of a semiconductor device according to an embodiment comprises, bonding a first semiconductor substrate and a second semiconductor substrate to form a stack, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first semiconductor substrate and an outer peripheral portion of the second semiconductor substrate, filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap and thinning the second semiconductor. ## Claims ### Claim 1 A semiconductor device manufacturing method, comprising: forming a first circuit unit and a first metal pad electrically connected to the first circuit unit on a first substrate, forming a second circuit unit and a second metal pad electrically connected to the second circuit unit on a second substrate; forming a stack bonding the first substrate and the second substrate by connecting the first metal pad and the second metal pad; filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first substrate and an outer peripheral portion of the second substrate; filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap; and thinning the second substrate. ### Claim 2 (depends on 1) The semiconductor device manufacturing method according to claim 1, wherein the first fill material includes an organic compound, and the second fill material includes a glass material or an inorganic polymer. ### Claim 3 (depends on 2) The semiconductor device manufacturing method according to claim 2, wherein, in a cross-sectional view of the stack, the gap is provided along a surface of the first substrate and a surface of the second substrate, and includes a first gap portion and a second gap portion, the first gap portion is located closer to a center of the first substrate and a center of the second substrate than an end of the first substrate and an end of the second substrate, and the second gap portion is provided adjacent to the first gap portion between the end of the first substrate and the end of the second substrate, and is located closer to a center of the first substrate and a center of the second substrate than an end of the first substrate and an end of the second substrate, and farther from the center of the first substrate and the center of the second substrate than the first gap portion. ### Claim 4 (depends on 3) The semiconductor device manufacturing method, according to claim 3, wherein, the first fill material is filled in the first gap portion, and the second fill material is filled in the second gap portion. ### Claim 5 (depends on 4) The semiconductor device manufacturing method according to claim 4, wherein, in a cross-sectional view of the stack, the thickness of the second gap portion is thicker than the thickness of the first gap portion. ### Claim 6 (depends on 4) The semiconductor device manufacturing method according to claim 4, wherein, the first fill material is filled in the first gap portion using a dropper, a dispenser, or a spin coat. ### Claim 7 (depends on 6) The semiconductor device manufacturing method according to claim 6, wherein, the second fill material is filled in the second gap portion by rubbing a film attached with the second fill material in a thin-film shape into the second gap portion along the outer circumference of the stack. ### Claim 8 (depends on 6) The semiconductor device manufacturing method according to claim 6, further comprising, removing the second fill material protruding from the second gap using a polishing film after filling the second fill material in the second gap portion. ### Claim 9 (depends on 6) The semiconductor device manufacturing method according to claim 6, further comprising, forming a through electrode on at least one of the first substrate and the second substrate before forming the stack. ### Claim 10 (depends on 1) The semiconductor device manufacturing method according to claim 1, wherein the first substrate and the second substrate are semiconductor substrates. ### Claim 11 (depends on 1) The semiconductor device manufacturing method according to claim 1, wherein the first substrate and the second substrate are wafers. ### Claim 12 A semiconductor device, comprising: a first substrate including a first circuit unit and a first metal pad electrically connected to the first circuit unit; a second substrate including a second circuit unit and a second metal pad electrically connected to the second circuit unit, the second substrate being bonded with the first substrate to form a stack and being thinner than the first substrate and the second metal pad being electrically connected to the first metal pad; a gap provided between an outer peripheral portion of the first substrate and an outer peripheral portion of the second substrate; a first fill material provided in the gap and having a first viscosity, and a second fill material provided in the gap adjacent to the first fill material and having a second viscosity higher than the first viscosity. ### Claim 13 (depends on 12) The semiconductor device according to claim 12, wherein the first fill material includes an organic compound, and the second fill material includes a glass material or an inorganic polymer. ### Claim 14 (depends on 13) The semiconductor device according to claim 13, wherein, in a cross-sectional view of the stack, the gap is provided along a surface of the first substrate and a surface of the second substrate, and includes a first gap portion and a second gap portion, the first gap portion is located closer to a center of the first substrate and a center of the second substrate than an end of the first substrate and an end of the second substrate, and the second gap portion is provided adjacent to the first gap portion between the end of the first substrate and the end of the second substrate, and is located closer to a center of the first substrate and a center of the second substrate than an end of the first substrate and an end of the second of substrate, and farther from the center of the first substrate and the center of the second substrate than the first gap portion. ### Claim 15 (depends on 14) The semiconductor device according to claim 14, wherein, the first fill material is provided in the first gap portion, and the second fill material is provided in the second gap portion. ### Claim 16 (depends on 15) The semiconductor device according to claim 15, wherein, in a cross-sectional view of the stack, the thickness of the second gap portion is thicker than the thickness of the first gap portion. ### Claim 17 (depends on 15) The semiconductor device according to claim 15, wherein at least one of the first substrate and the second substrate has a through electrode. ### Claim 18 (depends on 12) The semiconductor device according to claim 12, wherein the first substrate and the second substrate are semiconductor substrates. ### Claim 19 (depends on 12) The semiconductor device according to claim 12, wherein the first substrate and the second substrate are wafers. ### Claim 20 A semiconductor device manufacturing method, comprising: forming a first layer on a first substrate; forming a second layer on a second substrate; bonding the first layer and the second layer to form a stack; after bonding the first layer and the second layer, filling a first fill material having a first viscosity in a gap located between an outer peripheral portion of the first substrate and an outer peripheral portion of the second substrate; and filling a second fill material having a second viscosity higher than the first viscosity in the gap so as to be adjacent to the first fill material after filling the first fill material in the gap. ### Claim 21 A semiconductor device, comprising: a stack including; a first substrate; a second substrate provided above the first substrate; a first layer provided between the first substrate and the second substrate; a second layer provided between the first layer and the second substrate, the second layer being bonded with the first layer; a first gap portion provided between an outer peripheral portion of the first substrate and an outer peripheral portion of the second substrate, the first gap portion being filled with a first fill material provided in the gap and having a first viscosity; and a second gap portion provided between an outer peripheral portion of the first substrate and an outer peripheral portion of the second substrate, the second gap portion being filled with a second fill material provided in the gap adjacent to the first fill material and having a second viscosity higher than the first viscosity, wherein the first gap portion is provided between the first layer and the second gap portion.