# US 11,444,043 B2 · Substrate having embedded electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,043 B2 - Document ID: US11444043B2 - Status: Granted - Kind: B2 - Application number: 16/408,814 - Filed: 2019-05-10 - Published: 2019-08-29 - Granted: 2022-09-13 - Earliest claimed: 2017-03-28 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Hong In Kim; Thomas A Kim; Tae Sung Jeong - Web page: https://patentgrep.com/patent/US11444043B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 9/27: Spiral antennas - H10W 70/611: {for connecting multiple chips together} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/68: Shapes or dispositions thereof - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 44/248: {for antennas} - H10W 44/251: {for monolithic microwave integrated circuits [MMIC]} - H10W 70/095: {of vias therein} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer. ## Claims ### Claim 1 A substrate having an electronic component, comprising: a frame having a through hole, wherein the electronic component is disposed in the through hole; a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a wiring layer; a first layer, formed on an outer surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer; and a second wiring portion, formed on the first layer, comprising an antenna layer, wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer, and; wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer. ### Claim 2 (depends on 1) The substrate of claim 1, wherein the antenna layer comprises a plurality of layers. ### Claim 3 (depends on 1) The substrate of claim 1, wherein the electronic component comprises an RF IC chip disposed in a central portion of the through hole, and a passive device is disposed around the RF IC chip. ### Claim 4 (depends on 1) The substrate of claim 1, wherein the through hole is filled with a molding layer to fix the electronic component. ### Claim 5 (depends on 4) The substrate of claim 4, wherein a connection electrode is provided in the molding layer, and configured to form an external electrical connection. ### Claim 6 (depends on 1) The substrate of claim 1, wherein an inner surface of the frame is provided with a conductor layer. ### Claim 7 (depends on 1) The substrate of claim 1, wherein a via is formed in the frame to provide external electrical connection. ### Claim 8 (depends on 1) The substrate of claim 1, wherein the first layer is formed of a film of a photo imageable dielectric (PID) material. ### Claim 9 (depends on 1) The substrate of claim 1, wherein the antenna layer comprises a main antenna layer connected to the electronic component, and a dummy antenna layer disposed above the main antenna layer. ### Claim 10 (depends on 1) The substrate of claim 1, wherein a second insulating layer is formed on another surface of the frame and the electronic component. ### Claim 11 (depends on 10) The substrate of claim 10, wherein an electrode pad extends externally out of the second insulating layer. ### Claim 12 (depends on 11) The substrate of claim 11, wherein the electrode pad is connected to the electronic component through a via member. ### Claim 13 (depends on 1) The substrate of claim 1, wherein the antenna layer has any one or any combination of a spiral shape, a circular shape, an elliptical shape, a quadrangular spiral shape, a quadrangular shape, an elliptical spiral shape, a hexagonal shape, a hexagonal spiral shape, and a polygonal shape. ### Claim 14 (depends on 2) The substrate of claim 2, wherein a size of at least one layer of the plurality of layers is different from sizes of remaining layers of the plurality of layers. ### Claim 15 A substrate having an electronic component, comprising: a frame having a through hole, wherein the electronic component is disposed in the through hole; a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a first wiring layer; a first layer, formed on an outer surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer; a second wiring portion, formed on the first layer, comprising an antenna layer, wherein a second insulating layer is formed on another surface of the frame and the electronic component; and a via member connecting an electrode pad formed in the second insulating layer to the electronic component, wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer, and wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer. ### Claim 16 (depends on 15) The substrate of claim 15, wherein the antenna layer comprises a main antenna layer connected to the electronic component, and a dummy antenna layer disposed above the main antenna layer. ### Claim 17 (depends on 1) The substrate of claim 1, wherein the first layer is formed of a first material different from a second material of the second wiring portion. ### Claim 18 A substrate having an electronic component, comprising: a frame having a through hole, wherein the electronic component is disposed in the through hole; a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a first wiring layer; a first layer, formed on a surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer; a second wiring portion, formed on the first layer, comprising an antenna layer, wherein a second insulating layer is formed on another surface of the frame and the electronic component; and a via member connecting an electrode pad formed in the second insulating layer to the electronic component, wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer, wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer, the first layer excludes portions of the first wiring portion. ### Claim 19 (depends on 1) The substrate of claim 1, wherein the first layer is formed of a film of a photo imageable dielectric (PID) material, and the first layer is formed of a first material different from a second material of the second wiring portion. ### Claim 20 (depends on 1) The substrate of claim 1, wherein the top surface and the bottom surface of the first layer are flat.