# US 11,444,036 B2 · Power module assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,036 B2 - Document ID: US11444036B2 - Status: Granted - Kind: B2 - Application number: 17/155,956 - Filed: 2021-01-22 - Published: 2021-06-10 - Granted: 2022-09-13 - Earliest claimed: 2018-07-18 - Assignees: Delta Electronics (Shanghai) Co., Ltd. - Applicants: Delta Electronics (Shanghai) Co., Ltd. - Inventors: Shouyu Hong; Yan Tong; Weicheng Zhou; Dongfang Lian; Haiyang Cao; Haibin Xu; Tao Wang; Yicong Xie - Web page: https://patentgrep.com/patent/US11444036B2 ## CPC - H10W 90/00: Package configurations - H05K 7/14329: {specially adapted for the configuration of power bus bars} - H10W 20/427: {Power or ground buses} - H10W 20/435: {Cross-sectional shapes or dispositions of interconnections} - H10W 20/496: {Capacitor integral with wiring layers} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 72/00: Interconnections or connectors in packages - H10W 72/50: Bond wires - H10W 40/10: Arrangements for heating - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/07331: {Connecting techniques} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop. ## Claims ### Claim 1 A power module assembly, comprising: a package body comprising a first surface, a second surface, a first switch and a second switch, wherein the first surface and the second surface are opposite to each other, and the first switch and the second switch are embedded between the first surface and the second surface and connected to each other in series to form a bridge arm; a first wiring layer disposed on the first surface of the package body; a capacitor connected in parallel with the bridge arm to form a first high-frequency loop; and a system bus set comprising a positive-electrode bus and a negative-electrode bus fanned out from the first surface of the package body, respectively, wherein a projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with a projection of the first switch or/and the second switch on the first surface, and the projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with a projection of the capacitor on the first surface, wherein the bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop. ### Claim 2 (depends on 1) The power module assembly according to claim 1, wherein the capacitor is disposed on the first wiring layer and located outside the package body, and the capacitor is connected to the first switch and the second switch through the first wiring layer. ### Claim 3 (depends on 1) The power module assembly according to claim 1, wherein the first switch and the second switch both comprise a first end, a second end, and a third end. ### Claim 4 (depends on 3) The power module assembly according to claim 3, further comprising two driving components disposed on the first wiring layer and electrically connected to the first end and the second end of the first switch and the first end and the second end of the second switch, respectively. ### Claim 5 (depends on 3) The power module assembly according to claim 3, further comprising a substrate, wherein the substrate comprises a second wiring layer, the second wiring layer is disposed in the package body, and the first switch and the second switch are disposed on the second wiring layer. ### Claim 6 (depends on 5) The power module assembly according claim 5, wherein the first switch and the second switch are both vertical devices, the third end of the first switch faces the first surface, the second end of the second switch faces the first surface, and the second end of the first switch is electrically connected to the third end of the second switch through the second wiring layer. ### Claim 7 (depends on 3) The power module assembly according to claim 3, wherein the package body comprises a third wiring layer disposed between the first surface and the first switch and between the first surface and the second switch, and the second end of the first switch is electrically connected to the third end of the second switch through the third wiring layer. ### Claim 8 (depends on 7) The power module assembly according to claim 7, wherein the first switch and the second switch are both planar devices. ### Claim 9 (depends on 7) The power module assembly according to claim 7, wherein the thickness of the first wiring layer is less than the thickness of the third wiring layer. ### Claim 10 (depends on 7) The power module assembly according to claim 7, wherein the third wiring layer is a copper strip embedded in the package body. ### Claim 11 (depends on 3) The power module assembly according to claim 3, further comprising a metal conductive strip disposed on the first surface of the package body, wherein the second end of the first switch is electrically connected to the third end of the second switch through the metal conductive strip. ### Claim 12 (depends on 11) The power module assembly according to claim 11, wherein a projection of the metal conductive strip on the first surface and the projection of the positive-electrode bus and/or the negative-electrode bus on the first surface are at least partially overlapped. ### Claim 13 (depends on 11) The power module assembly according to claim 11, wherein the metal conductive strip comprises a slot, and the capacitor is accommodated in the slot. ### Claim 14 (depends on 3) The power module assembly according to claim 3, further comprising a carrier board and a control circuit, wherein the carrier board is disposed on at least one of the negative-electrode bus and the positive-electrode bus, and the control circuit is disposed on the carrier board to control the first switch and the second switch. ### Claim 15 (depends on 14) The power module assembly according to claim 14, further comprising two driving components disposed on the first wiring layer, wherein the two driving components receive a control signal outputted from the control circuit and output a driving signal to control the first switch and the second switch. ### Claim 16 (depends on 1) The power module assembly according to claim 1, further comprising a positive-electrode extension part and a negative-electrode extension part disposed on the first surface of the package body, wherein the positive-electrode extension part is connected to the positive-electrode bus, the negative-electrode extension part is connected to the negative-electrode bus, the positive-electrode bus and the negative-electrode bus is parallel to the first surface, and the projection of the positive-electrode bus on the first surface and the projection of the negative-electrode bus on the first surface are at least partially overlapped. ### Claim 17 (depends on 16) The power module assembly according to claim 16, wherein the system bus set comprises an output bus electrically connected to a midpoint of the bridge arm, wherein the output bus is parallel to the positive-electrode bus and the negative-electrode bus, and a projection of the output bus on the first surface and the projection of the positive-electrode bus and/or the negative-electrode bus on the first surface are at least partially overlapped. ### Claim 18 (depends on 17) The power module assembly according to claim 17, further comprising an output extension part disposed on the first surface of the package body, wherein the output extension part is connected to the output bus, wherein the system bus set comprises flexible insulators disposed between the positive-electrode bus and the negative-electrode bus, and between the negative-electrode bus and the output bus to compensate a dimensional tolerance caused by the height differences of the positive-electrode extension part, the negative-electrode extension part and the output extension part. ### Claim 19 (depends on 1) The power module assembly according to claim 1, further comprising a heat dissipation module and a thermal-conductive insulating layer, wherein the heat dissipation module is thermally coupled to the system bus set through the thermal-conductive insulating layer. ### Claim 20 (depends on 1) The power module assembly according to claim 1, further comprising a system capacitor electrically connected between the positive-electrode bus and the negative-electrode bus.