# US 11,444,015 B2 · Electronic device with stud bumps > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,015 B2 - Document ID: US11444015B2 - Status: Granted - Kind: B2 - Application number: 17/127,100 - Filed: 2020-12-18 - Published: 2021-04-08 - Granted: 2022-09-13 - Earliest claimed: 2018-02-26 - Assignees: TDK Corporation - Applicants: TDK Corporation - Inventors: Wolfgang Pahl - Web page: https://patentgrep.com/patent/US11444015B2 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - H10W 76/153: having interconnections in passages through the insulating or insulated base - B81B 7/0048: {between the MEMS die and the substrate} - B81C 1/00309: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 70/69: Insulating materials thereof - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 74/137: {the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)} - H10W 74/141: {the encapsulations being on at least the sidewalls of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - B81B 2201/0257: Microphones or microspeakers - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81C 2203/035: Soldering - H10W 70/68: Shapes or dispositions thereof - H10W 72/01208: {using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks} - H10W 72/01215: {forming coatings} - H10W 72/01225: {in solid form, e.g. by using a powder or by stud bumping} - H10W 72/01233: {in liquid form, e.g. spin coating, spray coating or immersion coating} - H10W 72/072: {of bump connectors} - H10W 72/07237: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - H10W 72/07254: {changes in dispositions} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/225: {Bumps having a filler embedded in a matrix} - H10W 72/232: {Plan-view shape, i.e. in top view} - H10W 72/234: {Cross-sectional shape, i.e. in side view} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/247: {Dispositions of multiple bumps} - H10W 72/248: {Top-view layouts, e.g. mirror arrays} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/253: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics} - H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract An electronic device with stud bumps is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess. ## Claims ### Claim 1 An electronic device comprising: a carrier board having an upper surface; and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess. ### Claim 2 (depends on 1) The electronic device according to claim 1, further comprising a polymer hood covering at least three sidewalls of the electronic chip. ### Claim 3 (depends on 1) The electronic device according to claim 1, wherein the stud bumps are connected to the upper surface of the carrier board by a conductive adhesive. ### Claim 4 (depends on 3) The electronic device according to claim 3, wherein the conductive adhesive has a Young's modulus of equal to or less than 500 MPa. ### Claim 5 (depends on 3) The electronic device according to claim 3, wherein the conductive adhesive has a Young's modulus of equal to or less than 100 MPa. ### Claim 6 (depends on 1) The electronic device according to claim 1, wherein the mounting side of the electronic chip is located at a distance from the upper surface of the carrier board thereby defining a clearance between the mounting side and the upper surface, and wherein the clearance is free of any underfill material. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein at least one of the stud bumps has a form-locking profile. ### Claim 8 (depends on 1) The electronic device according to claim 1, wherein at least one of the stud bumps has a height of equal to or greater than 30 μm and equal to or less than 180 μm. ### Claim 9 (depends on 1) The electronic device according to claim 1, further comprising a laminated polymer hood at least partly covering the top side of the electronic chip and extending onto the upper surface of the carrier board. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein the polymer hood comprises a B-stage material. ### Claim 11 (depends on 9) The electronic device according to claim 9, wherein the polymer hood has a thickness of equal to or greater than 10 μm and equal to or less than 80 μm. ### Claim 12 (depends on 9) The electronic device according to claim 9, wherein the polymer hood has a Young's modulus of equal to or less than 1 GPa at room temperature. ### Claim 13 (depends on 1) The electronic device according to claim 1, wherein the electronic chip is a sensor chip. ### Claim 14 (depends on 1) The electronic device according to claim 1, wherein the electronic chip is a MEMS chip. ### Claim 15 (depends on 7) The electronic device according to claim 7, wherein the form-locking profile comprises a tail that is a hook or a bracket, or that has a mushroom shape. ### Claim 16 An electronic device comprising: a carrier board having an upper surface; and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the stud bumps are connected to the upper surface of the carrier board by a conductive adhesive, and wherein the conductive adhesive has a Young's modulus of equal to or less than 500 MPa.