# US 11,444,006 B2 · Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,444,006 B2 - Document ID: US11444006B2 - Status: Granted - Kind: B2 - Application number: 16/912,969 - Filed: 2020-06-26 - Published: 2020-12-31 - Granted: 2022-09-13 - Earliest claimed: 2019-06-27 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Yukinori Hatori; Yasushi Araki; Akinobu Inoue; Tsukasa Nakanishi - Web page: https://patentgrep.com/patent/US11444006B2 ## CPC - H10W 70/421: {Shapes or dispositions} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} - H10W 70/042: {Etching} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/457: {of metallic layers on leadframes} - H10W 70/458: {of insulating layers on leadframes} - H10W 70/464: {Additional interconnections in combination with leadframes} - H10W 70/465: {Bumps or wires} - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 74/01: Manufacture or treatment - H10W 90/00: Package configurations - H10W 72/0198: {batch processes} - H10W 72/072: {of bump connectors} - H10W 72/073: {of die-attach connectors} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/30: Die-attach connectors - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 74/014: {using batch processing} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic component includes: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member. A first oxide film is provided on a surface of the first lead frame. A second oxide film is provided on a surface of the second lead frame. The first lead frame and the second lead frame are electrically connected to each other by the connection member. ## Claims ### Claim 1 An electronic component apparatus comprising: a first lead frame that has an inner side connection terminal and an outer side connection terminal; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member; wherein: a first oxide film is provided on a surface of the first lead frame; a second oxide film is provided on a surface of the second lead frame; the first lead frame and the second lead frame are electrically connected to each other by the connection member; a first connection portion exposed from the first oxide film is provided on an upper surface of the outer side connection terminal of the first lead frame; a second connection portion exposed from the second oxide film is provided on the surface of the second lead frame; the first connection portion and the second connection portion are bonded to the connection member; a third connection portion is provided on an upper surface of the inner side connection terminal of the first lead frame and is connected to the first electronic component; an external electrode is provided on a lower surface of the outer side connection terminal of the first lead frame; a thickness in a width direction of the electronic component apparatus of the inner side connection terminal of the first lead frame is less than that of the outer side connection terminal of the first lead frame; a first outer side face and a second outer side face of the outer side connection terminal of the first lead frame are exposed from an outer side face of the insulating resin; the first outer side face of the outer side connection terminal of the first lead frame is flush with the outer side face of the insulating resin; and the second outer side face of the outer side connection terminal of the first lead frame retracts from the outer side face of the insulating resin toward an inner side of the electronic component apparatus. ### Claim 2 (depends on 1) The electronic component apparatus according to claim 1, wherein: the connection member is formed to be thicker in thickness, in a height direction of the electronic component apparatus which is perpendicular to the width direction of the electronic component apparatus, than the first electronic component. ### Claim 3 (depends on 1) The electronic component apparatus according to claim 1, wherein: the connection member has a spacer and a solder; and the spacer is bonded to the first connection portion and the second connection portion by the solder. ### Claim 4 (depends on 1) The electronic component apparatus according to claim 1, wherein: the first oxide film is formed on the surface of the first lead frame so as to surround the first connection portion; and the second oxide film is formed on the surface of the second lead frame so as to surround the second connection portion. ### Claim 5 (depends on 3) The electronic component apparatus according to claim 3, wherein: the spacer is a core ball; and the solder covers the spacer. ### Claim 6 (depends on 3) The electronic component apparatus according to claim 3, wherein the spacer is a metal column. ### Claim 7 (depends on 6) The electronic component apparatus according to claim 6, wherein the solder is provided on each of an upper face and a lower face of the metal column. ### Claim 8 (depends on 1) The electronic component apparatus according to claim 1, wherein: the third connection portion is exposed from the first oxide film provided on the surface of the first lead frame. ### Claim 9 (depends on 8) The electronic component apparatus according to claim 8, wherein: the first oxide film is formed on the surface of the first lead frame so as to surround the third connection portion. ### Claim 10 (depends on 1) The electronic component apparatus according to claim 1, wherein: a fourth connection portion exposed from the second oxide film is provided on the surface of the second lead frame; and the first electronic component is electrically connected to the fourth connection portion. ### Claim 11 (depends on 10) The electronic component apparatus according to claim 10, wherein the second oxide film is formed on the surface of the second lead frame so as to surround the fourth connection portion. ### Claim 12 (depends on 1) The electronic component apparatus according to claim 1, wherein: a fifth connection portion exposed from the insulating resin and the second oxide film is provided on an upper face of the second lead frame; and the electronic component apparatus further comprises a second electronic component that is mounted on an upper face of the fifth connection portion to be electrically connected to the fifth connection portion. ### Claim 13 (depends on 12) The electronic component apparatus according to claim 12, wherein: the second oxide film is formed on the surface of the second lead frame so as to surround the fifth connection portion. ### Claim 14 (depends on 1) The electronic component apparatus according to claim 1, wherein the external electrode is exposed from the insulating resin and the first oxide film. ### Claim 15 (depends on 1) The electronic component apparatus according to claim 1, wherein: the first lead frame and the second lead frame are made of copper or a copper alloy; and each of the first oxide film and the second oxide film is a film of copper oxide containing a hydroxide. ### Claim 16 (depends on 1) The electronic component apparatus according to claim 1, wherein: the first connection portion and the second connection portion are covered by metal layers. ### Claim 17 An electronic component apparatus comprising: a first lead frame; a second lead frame that is provided on the first lead frame; a first electronic component that is provided between the first lead frame and the second lead frame; a connection member that is provided between the first lead frame and the second lead frame; and an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member, wherein: a first oxide film is provided on a surface of the first lead frame; a second oxide film is provided on a surface of the second lead frame; the first lead frame and the second lead frame are electrically connected to each other by the connection member; a first connection portion exposed from the first oxide film is provided on the surface of the first lead frame; a second connection portion exposed from the second oxide film is provided on the surface of the second lead frame; the first connection portion and the second connection portion are bonded to the connection member; the second lead frame has an inner side connection terminal and an outer side connection terminal; a third connection portion is provided on an upper surface of the inner side connection terminal; the electronic component apparatus further comprises a second electronic component that is mounted on an upper face of the third connection portion and electrically connected to the third connection portion; the second connection portion is provided on a lower surface of the outer side connection terminal; and a thickness of the outer side connection terminal is less than that of the inner side connection terminal. ### Claim 18 (depends on 17) The electronic component apparatus according to claim 17, wherein: an outer side face of the outer side connection terminal is exposed from an outer side face of the insulating resin, and the outer side face of the outer side connection terminal is flush with the outer side face of the insulating resin.