# US 11,443,994 B2 · Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package

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- Number: US 11,443,994 B2
- Document ID: US11443994B2
- Status: Granted
- Kind: B2
- Application number: 16/858,980
- Filed: 2020-04-27
- Published: 2021-02-25
- Granted: 2022-09-13
- Earliest claimed: 2019-08-21
- Assignees: Siliconware Precision Industries Co., Ltd.
- Applicants: Siliconwar E Pr Ecision Industries Co., Lt D.
- Inventors: Jin-Wei You; Cheng-Kai Chang
- Web page: https://patentgrep.com/patent/US11443994B2

## CPC

- H10P 72/74: {using temporarily an auxiliary support}
- H10W 74/10: characterised by their shape or disposition
- H01S 5/026: Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06)
- H10H 20/853: characterised by their shape
- H10H 20/858: Means for heat extraction or cooling
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 90/00: Package configurations
- H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/6528: {of the portions that connect to chips, wafers or package parts}
- H10W 72/072: {of bump connectors}
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07307: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/874: {On different surfaces}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/9413: {on encapsulations}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/291: {characterised by containers, encapsulations, or other housings for the stacked chips}
- H10W 90/295: {optical coupling}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.

## Claims

### Claim 1

An electronic package, comprising:
an encapsulation layer having a first surface, a second surface opposing the first surface, and a lateral surface adjoining the first surface and the second surface;
a first electronic component embedded in the encapsulation layer;
a plurality of conductive pillars embedded in the encapsulation layer;
a circuit structure formed on the first surface of the encapsulation layer and electrically connected to the conductive pillars and the first electronic component;
a laser component disposed on the circuit structure and electrically connected to the circuit structure; and
an optoelectronic component disposed on the circuit structure and electrically connected to the circuit structure,
wherein the laser component and the optoelectronic component are separated from each other, and wherein at least one of the laser component and the optoelectronic component protrudes from the lateral surface of the encapsulation layer.

### Claim 2 (depends on 1)

The electronic package of claim 1, wherein the plurality of conductive pillars surround the first electronic component.

### Claim 3 (depends on 1)

The electronic package of claim 1, further comprising a plurality of conductive bodies bonded and electrically connected to the first electronic component.

### Claim 4 (depends on 3)

The electronic package of claim 3, wherein the conductive bodies are embedded in the encapsulation layer and electrically connected to the circuit structure.

### Claim 5 (depends on 1)

The electronic package of claim 1, further comprising a circuit portion disposed on the second surface of the encapsulation layer and electrically connected to the conductive pillars.

### Claim 6 (depends on 5)

The electronic package of claim 5, further comprising a plurality of conductive elements disposed on the circuit portion.

### Claim 7 (depends on 1)

An electronic packaging module, comprising:
a main board; and
the electronic package of claim 1 disposed on the main board.

### Claim 8 (depends on 7)

The electronic packaging module of claim 7, further comprising at least one fourth electronic component disposed on the main board.

### Claim 9 (depends on 1)

The electronic package of claim 1, further comprising a carrying structure disposed on the second surface of the encapsulation layer.

### Claim 10 (depends on 9)

The electronic package of claim 9, further comprising at least one of a second electronic component and a heat sink disposed on the carrying structure.

### Claim 11 (depends on 10)

The electronic package of claim 10, further comprising a third electronic component disposed on the carrying structure.

### Claim 12 (depends on 10)

The electronic package of claim 10, further comprising a heat dissipating layer, wherein the heat sink is bonded via the heat dissipating layer to at least one of the laser component and the optoelectronic component.

### Claim 13

A method for fabricating an electronic package, comprising:
disposing a plurality of conductive pillars and at least one first electronic component on a carrying board;
forming on the carrying board an encapsulation layer encapsulating the first electronic component and the conductive pillars, the encapsulation layer having a first surface, a second surface opposing the first surface and bonded to the carrying board, with end surfaces of the conductive pillars exposed from the first surface of the encapsulation layer;
disposing a circuit structure on the first surface of the encapsulation layer and electrically connecting the circuit structure to the conductive pillars and the first electronic component, wherein the encapsulation layer has a lateral surface adjoining the first surface and the second surface;
disposing a laser component and an optoelectronic component on the circuit structure and electrically connecting the laser component and the optoelectronic component to the circuit structure, wherein the laser component and the optoelectronic component are separated from each other, and wherein at least one of the laser component and the optoelectronic component protrudes from the lateral surface of the encapsulation layer; and
removing the carrying board.

### Claim 14 (depends on 13)

The method of claim 13, wherein the plurality of conductive pillars surround the first electronic component.

### Claim 15 (depends on 13)

The method of claim 13, further comprising providing a plurality of conductive bodies and bonding and electrically connecting the conductive bodies to the first electronic component.

### Claim 16 (depends on 15)

The method of claim 15, wherein the conductive bodies are embedded in the encapsulation layer and electrically connected to the circuit structure.

### Claim 17 (depends on 13)

The method of claim 13, further comprising disposing a circuit portion on the second surface of the encapsulation layer and electrically connecting the circuit portion to the conductive pillars.

### Claim 18 (depends on 17)

The method of claim 17, further comprising disposing a plurality of conductive elements on the circuit portion.

### Claim 19 (depends on 13)

The method of claim 13, further comprising disposing a carrying structure on the second surface of the encapsulation layer.

### Claim 20 (depends on 19)

The method of claim 19, further comprising disposing a second electronic component on the carrying structure.