# US 11,443,981 B2 · Bonding method of package components and bonding apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,443,981 B2 - Document ID: US11443981B2 - Status: Granted - Kind: B2 - Application number: 16/866,565 - Filed: 2020-05-05 - Published: 2021-02-18 - Granted: 2022-09-13 - Earliest claimed: 2019-08-16 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Yi-Li Hsiao; Chih-Hang Tung; Chen-Hua Yu; Tung-Liang Shao; Su-Chun Yang - Web page: https://patentgrep.com/patent/US11443981B2 ## CPC - H10W 20/097: {by thermally treating} - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 72/0198: {batch processes} - H10W 95/00: Packaging processes not covered by the other groups of this subclass - H10W 72/07125: {Means for controlling the bonding environment, e.g. valves or vacuum pumps} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07183: {Means for monitoring} - H10W 72/072: {of bump connectors} - H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 72/07236: {Soldering or alloying} - H10W 72/07331: {Connecting techniques} - H10W 72/07335: {Applying EM radiation, e.g. induction heating or using a laser} - H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/30: Die-attach connectors - H10W 72/351: {Materials of die-attach connectors} - H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics} - H10W 72/354: {comprising polymers} - H10W 72/951: {Materials of bond pads} - H10W 72/983: {Reinforcing structures, e.g. collars} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors. ## Claims ### Claim 1 A bonding method of package components, comprising: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by an electromagnetic wave provided by an electromagnetic wave generator, in order to bond the first electrical connectors with the second electrical connectors, wherein the at least one first package component and the second package component are placed in a housing connected to the electromagnetic wave generator during the selectively heating, and an electromagnetic wave absorption tank is connected to the housing for absorbing excessive portions of the electromagnetic wave, wherein conductive elements in the at least one first package component and the second package component larger than a critical dimension are targeted by the selective heating, and the first and second connectors are included in the conductive elements larger than the critical dimension, wherein conductive elements smaller than the critical dimension as well as insulating elements in the at least one first package component and the second package component are not targeted by the selective heating. ### Claim 2 (depends on 1) The bonding method of the package components according to claim 1, wherein the first dielectric layer and the second dielectric layer are brought in contact during the step of bringing the at least one first package component and the second package component in contact. ### Claim 3 (depends on 2) The bonding method of the package components according to claim 2, further comprising: heating the first dielectric layer and the second dielectric layer after the step of bringing the at least one first package component and the second package component in contact, in order to bond the first dielectric layer with the second dielectric layer. ### Claim 4 (depends on 3) The bonding method of the package components according to claim 3, wherein an oven is configured to perform the heating of the first dielectric layer and the second dielectric layer, the at least one first package component and the second package component bonded with each other are moved out of the oven after the first dielectric layer is bonded with the second dielectric layer, and the first electrical connectors and the second electrical connectors are then subjected to the selectively heating after the first package component and the second package component are moved out of the oven. ### Claim 5 (depends on 3) The bonding method of the package components according to claim 3, wherein the at least one first package component comprises a plurality of the first package components, each of the first package components is a semiconductor chip, and the second package component is a device wafer or an interposer. ### Claim 6 (depends on 1) The bonding method of the package components according to claim 1, wherein dimensions of the first and second connectors and/or a frequency of an alternating current provided for generating an inductive heating is/are adjusted to ensure that the first and second connectors are selectively heated. ### Claim 7 (depends on 1) The bonding method of the package components according to claim 1, wherein the at least one package component and the second package component are entirely immersed in an electromagnetic field generated for performing the selective heating. ### Claim 8 (depends on 1) The bonding method of the package components according to claim 1, wherein the selective heating is performed intermittently. ### Claim 9 (depends on 1) The bonding method of the package components according to claim 1, wherein the selective heating is dynamically adjusted based on temperature variation of the at least one first package component and the second package component. ### Claim 10 (depends on 1) The bonding method of the package components according to claim 1, wherein a temperature of the conductive elements larger than the critical dimension is raised to a range between 180° C. to 350° C. during the selective heating. ### Claim 11 (depends on 10) The bonding method of the package components according to claim 10, wherein a temperature of the conductive elements smaller than the critical dimension and the insulating elements during the selective heating is kept at about 200° C. or less. ### Claim 12 A bonding apparatus, comprising: an electromagnetic wave generator; a housing, connected to the electromagnetic wave generator and configured to accommodate at least one first package component and a second package component on which the at least one first package component is placed, wherein first electrical connectors at a bonding surface of the at least one first package component approximate or contact second electrical connectors at a bonding surface of the second package component, the electromagnetic wave generator is configured to provide an electromagnetic wave into the housing for inducing heating of the first electrical connectors and the second electrical connectors, in order to bond the first electrical connectors with the second electrical connectors; and an electromagnetic wave absorption tank, wherein the electromagnetic wave absorption tank is connected to the housing via an additional wave guide and configured to absorb the electromagnetic wave, wherein conductive elements in the at least one first package component and the second package component larger than a critical dimension are targeted by the inductive heating, and the first and second connectors are included in the conductive elements larger than the critical dimension, and wherein conductive elements smaller than the critical dimension as well as insulating elements in the at least one first package component and the second package component are not targeted by the inductive heating. ### Claim 13 (depends on 12) The bonding apparatus according to claim 12, wherein the electromagnetic wave generator is connected to the housing via a wave guide. ### Claim 14 (depends on 12) The bonding apparatus according to claim 12, wherein the electromagnetic wave generator is a microwave generator. ### Claim 15 A bonding method of package components, comprising: placing a first package component on a second package component, wherein a first dielectric layer at a bonding surface of the first package component is in contact with a second dielectric layer at a bonding surface of the second package component, and first electrical connectors at the bonding surface of the first package component are aligned with second electrical connectors at the bonding surface of the second package component; non-selectively heating the first and second package components, such that the first dielectric layer is bonded with the second dielectric layer; and selectively heating conductive elements in the first and second package components larger than a critical dimension by an electromagnetic wave provided by an electromagnetic wave generator, wherein the first and second electrical connectors are included in the conductive elements larger than the critical dimension, the first electrical connectors are bonded with the second electrical connectors as a result of the selective heating, conductive elements smaller than the critical dimension as well as insulating elements in the first and second package components are not targeted by the selective heating, the first and second package components are placed in a housing connected to the electromagnetic wave generator during the selectively heating, and an electromagnetic wave absorption tank is connected to the housing for absorbing excessive portions of the electromagnetic wave. ### Claim 16 (depends on 15) The bonding method of the package components according to claim 15, wherein the first and second package components are non-selectively heated by laser light, hot air or infrared light. ### Claim 17 (depends on 15) The bonding method of the package components according to claim 15, wherein the first electrical connectors are laterally surrounded by a first seal ring, and the second electrical connectors are laterally surrounded by a second seal ring. ### Claim 18 (depends on 17) The bonding method of the package components according to claim 17, wherein the first seal ring has separate portions arranged along a path laterally enclosing the first electrical connectors, and the second seal ring has separate portions arranged along a path laterally enclosing the second electrical connectors. ### Claim 19 (depends on 15) The bonding method of the package components according to claim 15, wherein the first electrical connectors are laterally surrounded by a first seal ring and a second seal ring at an outer side of the first seal ring, and the second electrical connectors are laterally surrounded by a third seal ring and a fourth seal ring at an outer side of the third seal ring. ### Claim 20 (depends on 19) The bonding method of the package components according to claim 19, wherein the first seal ring, the second seal ring, the third seal ring and the fourth seal ring respectively have separate portions, spacing between the portions of the first seal ring is offset from spacing between the portions of the second seal ring, and spacing between the portions of the third seal ring is offset from spacing between the portions of the fourth seal ring.