# US 11,443,951 B2 · Resin protection member forming apparatus

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- Number: US 11,443,951 B2
- Document ID: US11443951B2
- Status: Granted
- Kind: B2
- Application number: 17/089,049
- Filed: 2020-11-04
- Published: 2021-05-06
- Granted: 2022-09-13
- Earliest claimed: 2019-11-06
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Yoshinobu Saito
- Web page: https://patentgrep.com/patent/US11443951B2

## CPC

- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P 72/0434: {mainly by convection}
- B05C 11/023: {Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface (B05C11/021, B05C11/04 take precedence)}
- B05C 11/10: Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material {(B05C1/0813, B05C5/0225, B05C17/002 and B05C19/06 take precedence)}
- B29C 43/52: Heating or cooling
- B29C 45/03: Injection moulding apparatus (transfer moulding B29C45/02)
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 14/6508: {by exposure to a liquid}
- H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like}
- H10W 40/28: comprising Peltier coolers
- B29K 2101/12: Thermoplastic materials
- B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A resin protection member forming apparatus includes a stage having a resin placement surface on which a particulate thermoplastic resin is to be placed. The stage includes a Peltier device, a DC power source, and a switch. The Peltier device is disposed inside the stage and has an upper surface, which is parallel and close to the resin placement surface, and a lower surface, which is far from the resin placement surface. The DC power source supplies a DC current to the Peltier device. The switch changes a direction of the DC current to be supplied to the Peltier device, between a first direction to heat the upper surface of the Peltier device and a second direction, opposite to the first direction, to cool the upper surface of the Peltier device.

## Claims

### Claim 1

A resin protection member forming apparatus, comprising:
a stage having a resin placement surface on which a particulate thermoplastic resin is to be placed;
a wafer holding unit that has a wafer holding surface facing the resin placement surface and holds a wafer by the wafer holding surface;
an up/down moving mechanism configured to relatively move the stage and the wafer holding unit in an up/down direction vertical to the resin placement surface; and
a control unit,
wherein the stage includes
a Peltier device disposed inside the stage and having an upper surface and a lower surface, the upper surface being parallel and close to the resin placement surface, the lower surface being far from the resin placement surface,
a direct current power source that supplies a direct current to the Peltier device, and
a switch that changes a direction of the direct current to be supplied to the Peltier device, between a first direction to heat the upper surface of the Peltier device and a second direction, opposite to the first direction, to cool the upper surface of the Peltier device, and
wherein the control unit controls the switch to cause the direct current to flow in the first direction so that the upper surface of the Peltier device is heated to melt the thermoplastic resin placed on the resin placement surface and that the resulting molten resin is pressed and spread over an entire surface of one side of the wafer between the resin placement surface and the one side of the wafer, and
then controls the switch to cause the direct current to flow in the second direction so that the upper surface of the Peltier device is cooled to solidify the resin pressed and spread between the resin placement surface and the one side of the wafer and that a protection member is formed on the entire surface of the one side of the wafer.