# US 11,443,897 B2 · Electronic component

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- Number: US 11,443,897 B2
- Document ID: US11443897B2
- Status: Granted
- Kind: B2
- Application number: 17/243,961
- Filed: 2021-04-29
- Published: 2021-11-18
- Granted: 2022-09-13
- Earliest claimed: 2020-05-15
- Assignees: TDK Corporation
- Applicants: TDK Corporation
- Inventors: Toshihiro Iguchi; Norihisa Ando; Kenya Tamaki; Kayou Matsunaga
- Web page: https://patentgrep.com/patent/US11443897B2

## CPC

- H01G 4/2325: {characterised by the material of the terminals}
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/005: Electrodes
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)}
- H05K 3/3426: {characterised by the leads}
- H05K 3/4015: {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/1031: Surface mounted metallic connector elements
- H05K 2201/10515: Stacked components
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

## Claims

### Claim 1

An electronic component comprising:
an element body;
an external electrode disposed on the element body; and
a metal terminal including a connection part opposing the external electrode and connected to the external electrode with solder, and a leg part extending from the connection part, wherein
each of the connection part and the leg part includes:
a base including a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface;
a first metal layer disposed on the first surface and connected to the solder;
a second metal layer disposed on the second surface; and
a coating layer disposed on each of the third surfaces,
the first metal layer and the second metal layer each include an outermost layer containing Sn, and
each coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

### Claim 2 (depends on 1)

The electronic component according to claim 1, wherein
the outermost layer of the coating layer is made of an oxide film.

### Claim 3 (depends on 2)

The electronic component according to claim 2, wherein
the base is made of stainless steel.

### Claim 4 (depends on 1)

The electronic component according to claim 1, wherein
an end edge of the metal terminal protrudes further than an end edge of the external electrode when viewed in a direction opposite to a direction in which the leg part extends from the connection part.

### Claim 5 (depends on 1)

The electronic component according to claim 1, wherein
the metal terminal includes a ridge part at a position corresponding to a ridge defined by the first surface and each of the third surfaces, the ridge part protruding in a direction from the second surface toward the first surface.

### Claim 6 (depends on 1)

The electronic component according to claim 1, wherein
a ratio of an area of the solder to an area of the element body is equal to or less than 90% when viewed in a direction in which the first surface and the second surface oppose each other.

### Claim 7 (depends on 1)

The electronic component according to claim 1, wherein
when viewed in a direction in which the first surface and the second surface oppose each other, an outermost peripheral edge of the solder is located inside an outermost edge of the metal terminal and separate from the outermost edge in a direction in which the pair of third surfaces oppose each other.