# US 11,443,885 B2 · Thin film barrier seed metallization in magnetic-plugged through hole inductor

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- Number: US 11,443,885 B2
- Document ID: US11443885B2
- Status: Granted
- Kind: B2
- Application number: 15/919,066
- Filed: 2018-03-12
- Published: 2019-09-12
- Granted: 2022-09-13
- Earliest claimed: 2018-03-12
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Kristof Darmawikarta; Srinivas Pietambaram; Sandeep Gaan; Sri Ranga Sai Boyapati; Prithwish Chatterjee; Sameer Paital; Rahul Jain; Junnan Zhao
- Web page: https://patentgrep.com/patent/US11443885B2

## CPC

- H01F 27/2804: {Printed windings}
- H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)}
- H01F 17/06: with core substantially closed in itself, e.g. toroid
- H01F 27/24: Magnetic cores
- H01F 41/042: {by thin film techniques}
- H01F 41/046: {structurally combined with ferromagnetic material}
- H05K 1/165: {incorporating printed inductors}
- H01F 2017/002: {Details of via holes for interconnecting the layers}
- H05K 2201/086: for inductive purposes, e.g. printed inductor with ferrite core
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Embodiments include inductors and methods of forming inductors. In an embodiment, an inductor may include a substrate core and a conductive through-hole through the substrate core. Embodiments may also include a magnetic sheath around the conductive through hole. In an embodiment, the magnetic sheath is separated from the plated through hole by a barrier layer. In an embodiment, the barrier layer is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath.

## Claims

### Claim 1

An inductor, comprising;
a substrate core, the substrate core having an uppermost surface;
a conductive through-hole through the substrate core; and
a magnetic sheath around the conductive through-hole, the magnetic sheath having an uppermost surface above the uppermost surface of the substrate core, wherein the magnetic sheath is separated from the conductive through-hole by a barrier layer that is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath, the barrier layer further vertically overlapping with the substrate core.

### Claim 2 (depends on 1)

The inductor of claim 1, wherein the first surface of the magnetic sheath is substantially coplanar with a first surface of the substrate core and wherein the second surface of the magnetic sheath is substantially coplanar with a second surface of the substrate core.

### Claim 3 (depends on 2)

The inductor of claim 2, wherein the barrier layer is in contact with and over the first surface of the substrate core and the second surface of the substrate core.

### Claim 4 (depends on 3)

The inductor of claim 3, wherein the magnetic sheath is fully embedded, wherein an outer surface of the magnetic sheath is in direct contact with the substrate core.

### Claim 5 (depends on 1)

The inductor of claim 1, wherein a thickness of the barrier layer is 1 μm or less.

### Claim 6 (depends on 1)

The inductor of claim 1, wherein a thickness of the magnetic sheath is 50 μm or greater.

### Claim 7 (depends on 1)

The inductor of claim 1, wherein the first surface of the magnetic sheath is not substantially coplanar with a first surface of the substrate core and wherein the second surface of the magnetic sheath is not substantially coplanar with a second surface of the substrate core.

### Claim 8 (depends on 7)

The inductor of claim 7, wherein a first film layer is formed over the first surface and a second film layer is formed over the second surface of the substrate core, and wherein the first and second film layers are in direct contact with the magnetic sheath.

### Claim 9 (depends on 8)

The inductor of claim 8, wherein the first surface of the magnetic sheath is substantially coplanar with a top surface of the first film layer, and wherein a second surface of the magnetic sheath is substantially coplanar with a surface of the second film layer.

### Claim 10 (depends on 1)

The inductor of claim 1, wherein a permeability of the magnetic sheath is greater than 10.

### Claim 11 (depends on 1)

The inductor of claim 1, further comprising a plugging layer filling the conductive through-hole, wherein the plugging layer comprises a dielectric material.

### Claim 12

An inductor, comprising;
a substrate core;
a conductive through-hole through the substrate core; and
a magnetic sheath around the conductive through-hole, wherein the magnetic sheath is separated from the conductive through-hole by a barrier layer that is formed over an inner surface of the magnetic sheath and over first and second surfaces of the magnetic sheath, wherein the first surface of the magnetic sheath is not substantially coplanar with a first surface of the substrate core and wherein the second surface of the magnetic sheath is not substantially coplanar with a second surface of the substrate core, wherein a first film layer is formed over the first surface and a second film layer is formed over the second surface of the substrate core, and wherein the first and second film layers are in direct contact with the magnetic sheath.