# US 11,442,583 B2 · Fingerprint identification module, manufacturing method thereof and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,442,583 B2 - Document ID: US11442583B2 - Status: Granted - Kind: B2 - Application number: 16/966,394 - Filed: 2020-01-17 - Published: 2021-07-01 - Granted: 2022-09-13 - Earliest claimed: 2019-01-28 - Assignees: Beijing BOE Technology Development Co., Ltd. - Applicants: Boe Technology Group Co., Ltd. - Inventors: Wenqu Liu; Xiufeng Li; Qi Yao; Feng Zhang; Liwen Dong; Zhao Cui; Chuanxiang Xu; Detian Meng; Xiaoxin Song; Libo Wang; Yang Yue; Dongfei Hou; Zhijun Lv - Web page: https://patentgrep.com/patent/US11442583B2 ## CPC - G06F 3/0436: {in which generating transducers and detecting transducers are attached to a single acoustic waves transmission substrate} - G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads} - G06F 3/0433: {in which the acoustic waves are either generated by a movable member and propagated within a surface layer or propagated within a surface layer and captured by a movable member} - G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer} - G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing} - G06V 40/1365: {Matching; Classification} - H10N 30/05: Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes - H10N 30/302: {Sensors} - H10N 30/50: having a stacked or multilayer structure - H10N 30/802: {Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits} - H10N 30/877: {Conductive materials} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. In the fingerprint identification module, an auxiliary structure is at least partially located on a functional substrate, and a plurality of first driving electrodes are on a side, away from the functional substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer. ## Claims ### Claim 1 A fingerprint identification module, comprising: a functional substrate; a piezoelectric material layer on the functional substrate; an auxiliary structure at least partially located on the functional substrate; a plurality of first driving electrodes at a side, away from the functional substrate, of the piezoelectric material layer and the auxiliary structure, wherein each of the first driving electrodes extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure comprises a slope portion; a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer; the second direction intersects with the first direction. ### Claim 2 (depends on 1) The fingerprint identification module according to claim 1, wherein a slope angle of the slope portion is less than 60 degrees. ### Claim 3 (depends on 1) The fingerprint identification module according to claim 1, wherein the auxiliary structure comprises: a main body portion on the functional substrate and in the same layer as the piezoelectric material layer; and an overlapping portion connected with the main body portion and located at a side, away from the functional substrate, of the first edge of the piezoelectric material layer. ### Claim 4 (depends on 3) The fingerprint identification module according to claim 3, wherein a size of the overlapping portion in the first direction is larger than 200 microns. ### Claim 5 (depends on 1) The fingerprint identification module according to claim 1, wherein a material of the auxiliary structure comprises a curing adhesive. ### Claim 6 (depends on 1) The fingerprint identification module according to claim 1, wherein a material of the auxiliary structure comprises an optical curing adhesive. ### Claim 7 (depends on 1) The fingerprint identification module according to claim 1, wherein a material of the piezoelectric material layer comprises polyvinylidene fluoride. ### Claim 8 (depends on 1) The fingerprint identification module according to claim 1, wherein the auxiliary structure is arranged along an edge of the piezoelectric material layer, and the auxiliary structure is also in contact with a second edge of the piezoelectric material layer in the second direction. ### Claim 9 (depends on 1) The fingerprint identification module according to claim 1, wherein each of the first driving electrodes comprises a metal layer and a transparent metal oxide layer which are sequentially stacked in the direction perpendicular to the functional substrate. ### Claim 10 (depends on 1) The fingerprint identification module according to claim 1, further comprising: a first insulating layer at a side, away from the functional substrate, of the plurality of first driving electrodes; an acoustic wave reflective layer at a side, away from the plurality of first driving electrodes, of the first insulating layer, wherein an orthographic projection of the acoustic wave reflective layer on the functional substrate is overlapped with an orthographic projection of the piezoelectric material layer on the functional substrate. ### Claim 11 (depends on 1) The fingerprint identification module according to claim 1, wherein the functional substrate comprises: a substrate; a receiving electrode layer which is at a side, close to the substrate, of the piezoelectric material layer and comprises a plurality of receiving electrodes; and a driving circuit layer which is at a side, close to the substrate, of the receiving electrode and comprises a plurality of driving units, wherein orthographic projections of the plurality of receiving electrodes on the substrate are at least partially overlapped with an orthographic projection of the piezoelectric material layer, and the orthographic projections of the plurality of receiving electrodes on the substrate are at least partially overlapped with orthographic projections of the first driving electrodes. ### Claim 12 (depends on 11) The fingerprint identification module according to claim 11, wherein the functional substrate further comprises: a second insulating layer between the receiving electrode layer and the piezoelectric material layer. ### Claim 13 (depends on 11) The fingerprint identification module according to claim 11, wherein the functional substrate further comprises: a plurality of second driving electrodes between the receiving electrode layer and the driving circuit layer, wherein the plurality of first driving electrodes and the plurality of second driving electrodes constitute a plurality of driving electrode pairs, and an orthographic projection of a first driving electrode and an orthographic projection of a second driving electrode which belong to each of the driving electrode pairs on the piezoelectric material layer are at least partially overlapped with each other. ### Claim 14 (depends on 1) An electronic device, comprising the fingerprint identification module according to claim 1. ### Claim 15 A manufacturing method of a fingerprint identification module, comprising: providing a functional substrate; forming a piezoelectric material layer on the functional substrate; forming an auxiliary structure on the functional substrate on which the piezoelectric material layer is formed; and forming a plurality of first driving electrodes on a side, away from the functional substrate, of the piezoelectric material layer and the auxiliary structure, wherein each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure comprises a slope portion; a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer; and the second direction intersects with the first direction. ### Claim 16 (depends on 15) The manufacturing method of the fingerprint identification module according to claim 15, wherein forming the auxiliary structure on the functional substrate on which the piezoelectric material layer is formed comprises: coating a liquid curing adhesive on the functional substrate on which the piezoelectric material layer is formed; patterning the liquid curing adhesive to at least expose a part of the piezoelectric material layer; and curing the liquid curing adhesive, wherein the liquid curing adhesive is leveled and cured to form the slope portion. ### Claim 17 (depends on 16) The manufacturing method of the fingerprint identification module according to claim 16, wherein forming the auxiliary structure on the functional substrate on which the piezoelectric material layer is formed comprises: patterning the liquid curing adhesive to at least expose the part of the piezoelectric material layer to form a main body portion which is on the functional substrate and in the same layer as the piezoelectric material layer, and to form an overlapping portion which is connected with the main body portion and located at a side, away from the functional substrate, of the first edge of the piezoelectric material layer. ### Claim 18 (depends on 17) The manufacturing method of the fingerprint identification module according to claim 17, wherein a size of the overlapping portion in the first direction is larger than 200 microns. ### Claim 19 (depends on 15) The manufacturing method of the fingerprint identification module according to claim 15, wherein forming the plurality of first driving electrodes on the side, away from the functional substrate, of the piezoelectric material layer and the auxiliary structure comprises: forming a metal layer on the side, away from the functional substrate, of the piezoelectric material layer and the auxiliary structure; forming a transparent metal oxide layer on a side, away from the piezoelectric material layer, of the metal layer; patterning the transparent metal oxide layer to form a plurality of strip-shaped transparent metal oxides; and etching the metal layer by using the plurality of strip-shaped transparent metal oxides as a mask to form the plurality of first driving electrodes. ### Claim 20 (depends on 15) The manufacturing method of the fingerprint identification module according to claim 15, wherein forming the piezoelectric material layer on the functional substrate comprises: coating and crystallizing a piezoelectric material on the functional substrate; forming a hard mask on the piezoelectric material after crystallization; and etching the piezoelectric material after crystallization by using the hard mask as a mask to form the piezoelectric material layer, wherein a material of the hard mask comprises at least one selected from the group consisting of molybdenum, aluminum, titanium, niobium and indium tin oxide.