# US 11,442,565 B2 · Flexible integrated display module, manufacturing method thereof, and display device

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- Number: US 11,442,565 B2
- Document ID: US11442565B2
- Status: Granted
- Kind: B2
- Application number: 16/633,401
- Filed: 2019-09-20
- Published: 2021-12-30
- Granted: 2022-09-13
- Earliest claimed: 2019-08-12
- Assignees: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., LTD.
- Inventors: Jinrong Zhao
- Web page: https://patentgrep.com/patent/US11442565B2

## CPC

- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads}
- G06F 3/0443: {using a single layer of sensing electrodes}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/688: {Flexible insulating substrates}
- H10W 90/00: Package configurations
- G06F 2203/04102: Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/01371: {Cleaning, e.g. oxide removal or de-smearing}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07311: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02E 10/549: Organic PV cells
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

The present invention discloses a flexible integrated display panel module and manufacturing method thereof, the flexible integrated display panel module includes a flexible integrated display substrate, which including an integrated area, an active area and a non-display disposed at one side of the integrated area, the integrated area divided into a plurality of areas, used to defined as a corresponding functional area. The functional area includes: a display wiring functional area and a plurality of direct on-cell touch control wiring functional areas disposed on both sides of the display functional area.

## Claims

### Claim 1

A flexible integrated display panel module, comprising: a flexible integrated display substrate;
the flexible integrated display substrate comprising an integrated area, an active area disposed at one side of the integrated area, and a non-active area disposed surrounding the active area, the integrated area divided into a plurality of areas, each of the areas defined as a corresponding functional area;
the functional area comprising: a display wiring functional area and a plurality of direct on-cell touch control wiring functional areas, the plurality of direct on-cell touch control wiring functional areas disposed on both sides of the display functional area; the display functional area used to set a display wiring and a chip on film packaging wiring; and the direct on-cell touch control wiring functional areas used to set a direct on-cell touch control wiring,
wherein the flexible integrated display panel module further comprises a touch control display driving integrated circuit chip, the touch control display driving integrated circuit chip laminated on the integrated area of the flexible integrated display substrate.

### Claim 2 (depends on 1)

The flexible integrated display panel module as claimed in claim 1, wherein the touch control display driving integrated circuit chip used to generate a driving signal for display and touch control circuit of the active area and the non-active area, and provide a driving signal to a touch control panel of the corresponding active area and the non-active area.

### Claim 3 (depends on 1)

The flexible integrated display panel module as claimed in claim 1, wherein the flexible integrated display panel module comprises a touch control display driving integrated circuit chip, the touch control display driving integrated circuit chip disposed on an external driving system printed circuit board or on an external fixable printed circuit board of the flexible integrated display substrate, the touch control display driving integrated circuit chip used to generate a driving signal for display and touch control circuit of the active area and the non-active area, and provide a driving signal to a touch control panel of the corresponding active area and the non-active area.

### Claim 4 (depends on 3)

The flexible integrated display panel module as claimed in claim 3, wherein the external driving system printed circuit board connected to the flexible integrated display substrate by a connector.

### Claim 5 (depends on 1)

A display device, comprising a flexible integrated display panel module as claimed in claim 1.

### Claim 6

A manufacturing method of a flexible integrated display panel module, comprising steps as below:
providing a flexible integrated display substrate;
forming an integrated area on the flexible integrated display substrate, dividing the integrated area into a plurality of areas, each of the areas defining a corresponding functional area;
dividing one side of the integrated area on the flexible integrated display substrate into an active area and a non-active area;
forming a functional wiring film layer on the corresponding functional area by physical vapor deposition method;
performing a photoresist coating, exposure, and development on the functional wiring film layer to pattern the photoresist;
patterning the functional wiring film layer under the photoresist by etching method, and corresponding to the patterned photoresist; and
stripping the patterned photoresist,
wherein after the step of stripping the patterned photoresist, comprising:
defining a bonding area in the integrated area;
cleaning the bonding area;
attaching an anisotropic conductive film layer to the bonding area;
disposing a touch control display driving integrated circuit chip on the anisotropic conductive film layer by pre-laminating method; and
performing main-press to the touch control display driving integrated circuit chip.

### Claim 7 (depends on 6)

The manufacturing method of flexible integrated display panel module as claimed in claim 6, wherein after the step of stripping the patterned photoresist, comprising:
defining a bonding area on an external driving system printed circuit board of the flexible integrated display substrate;
cleaning the bonding area;
attaching an anisotropic conductive film layer to the bonding area;
disposing a touch control display driving integrated circuit chip on the anisotropic conductive film layer by pre-laminating method; and
performing main-press to the touch control display driving integrated circuit chip.

### Claim 8 (depends on 7)

The manufacturing method of flexible integrated display panel module as claimed in claim 7, wherein in the step of defining a bonding area, comprising manufacturing a connector for connecting the flexible integrated display substrate and external driving system printed circuit board by surface assembly technology.