# US 11,442,367 B2 · Optimizing a sequence of processes for manufacturing of product units > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,442,367 B2 - Document ID: US11442367B2 - Status: Granted - Kind: B2 - Application number: 17/411,107 - Filed: 2021-08-25 - Published: 2021-12-16 - Granted: 2022-09-13 - Earliest claimed: 2017-04-28 - Assignees: ASML Netherlands B.V. - Applicants: Asml Netherlands B.V. - Inventors: Jochem Sebastiaan Wildenberg; Marinus Jochemsen; Erik Jensen; Erik Johannes Maria Wallerbos; Cornelis Johannes Rijnierse; Bijoy Rajasekharan; Roy Werkman; Jurgen Johannes Henderikus Maria Schoonus - Web page: https://patentgrep.com/patent/US11442367B2 ## CPC - G03F 7/70525: {Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure} - G03F 7/705: {Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions} - G03F 7/70625: {Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness} - G03F 7/70633: {Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching} - G05B 19/41865: {characterised by job scheduling, process planning, material flow} - G05B 2219/32291: Task sequence optimization - G05B 2219/45031: Manufacturing semiconductor wafers - Y02P 90/02: Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter. ## Claims ### Claim 1 A method for configuring processing of product units, the method comprising: obtaining a first characteristic of a first process, wherein the first process is used in processing one or more product units and the first process comprises performing a deposition on the one or more product units, patterning of the one or more product units using an exposure step and/or using a resist development process on the one or more product units; obtaining a second characteristic of a second process, the second process to be used in processing the one or more product units; determining, by a hardware computer system using the obtained first and second characteristics, a prediction of a performance parameter associated with the at least one product unit of the one or more product units after being processed using the second process; and determining a correction to a future process to be used in processing the at least one product unit of the one or more product units based on the determined prediction. ### Claim 2 (depends on 1) The method according to claim 1, wherein the first characteristic of the first process is an after development overlay fingerprint. ### Claim 3 (depends on 1) The method according to claim 1, wherein the second process is a process of etching product units and the second characteristic of the second process is context data of an etcher to be used to etch the at least one product unit of the one or more product units. ### Claim 4 (depends on 1) The method according to claim 1, wherein the performance parameter is after etch overlay. ### Claim 5 (depends on 1) The method according to claim 1, wherein the future process is a process of patterning product units using an exposure step and/or using a resist development process. ### Claim 6 (depends on 1) The method according to claim 1, further comprising applying the correction to an apparatus to be used in performing the future process. ### Claim 7 (depends on 1) The method according to claim 1, wherein the determining of the predicted performance parameter is based on using a model derived from analysis of a plurality of measurement results of the performance parameter associated with a plurality of product units and characteristics of the first and second process used in processing the plurality of product units. ### Claim 8 (depends on 1) The method according to claim 1, further comprising obtaining the second characteristic of the second process used in processing the one or more product units. ### Claim 9 (depends on 8) The method according to claim 8, wherein the determining of the predicted performance parameter comprises deriving a model from analysis of a plurality of measurement results of the performance parameter corresponding to a plurality of second characteristics of the second process. ### Claim 10 A computer program product comprising a non-transitory computer-readable medium having computer readable instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to at least: obtain a first characteristic of a first process, wherein the first process is used in processing one or more product units and the first process comprises performing a deposition on the one or more product units, patterning of the one or more product units using an exposure step and/or using a resist development process on the one or more product units; obtain a second characteristic of a second process, the second process to be used in processing the one or more product units; determine, using the obtained first and second characteristic, a prediction of a performance parameter associated with the at least one product unit of the one or more product units after being processed using the second process; and determine a correction to a future process to be used in processing the at least one product unit of the one or more product units based on the determined prediction. ### Claim 11 (depends on 10) The computer program product according to claim 10, wherein the first characteristic of the first process is an after development overlay fingerprint. ### Claim 12 (depends on 10) The computer program product according to claim 10, wherein the second process is a process of etching product units and the second characteristic of the second process is context data of an etcher to be used to etch the at least one product unit of the one or more product units. ### Claim 13 (depends on 10) The computer program product according to claim 10, wherein the performance parameter is after etch overlay. ### Claim 14 (depends on 10) The computer program product according to claim 10, wherein the future process is a process of patterning product units using an exposure step and/or using a resist development process. ### Claim 15 (depends on 10) The computer program product according to claim 10, wherein the instructions are further configured to cause the computer system to cause application of the correction to an apparatus to be used in performing the future process. ### Claim 16 (depends on 10) The computer program product according to claim 10, wherein the instructions are further configured to cause the computer system to obtain the second characteristic of the second process used in processing the one or more product units. ### Claim 17 (depends on 10) The computer program product according to claim 10, wherein the instructions configured to cause the computer system to determine the predicted performance parameter are further configured to cause the computer system to derive a model from analysis of a plurality of measurement results of the performance parameter corresponding to a plurality of second characteristics of the second process. ### Claim 18 (depends on 10) The computer program product according to claim 10, wherein the instructions configured to cause the computer system to determine the predicted performance parameter are further configured to cause the computer system to determine the predicted performance parameter based on using a model derived from analysis of a plurality of measurement results of the performance parameter associated with a plurality of product units and characteristics of the first and second process used in processing the plurality of product units. ### Claim 19 A computer program product comprising a non-transitory computer-readable medium having computer readable instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to at least: obtain a first characteristic of a first process, wherein the first process is used in processing one or more product units; obtain a second characteristic of a second process, the second process to be used in processing the one or more product units; determine, using the obtained first and second characteristic and using a model, a prediction of a performance parameter associated with the at least one product unit of the one or more product units after being processed using the second process, the model derived from analysis of a plurality of measurement results of the performance parameter associated with a plurality of product units and characteristics of the first and second process used in processing the plurality of product units; and determine a correction to a future process to be used in processing the at least one product unit of the one or more product units based on the determined prediction. ### Claim 20 (depends on 19) The computer program product according to claim 19, wherein the future process is a process of patterning product units using an exposure step and/or using a resist development process.