# US 11,441,956 B1 · System and method for fabricating a strain sensing device directly on a structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,441,956 B1 - Document ID: US11441956B1 - Status: Granted - Kind: B1 - Application number: 16/992,169 - Filed: 2020-08-13 - Granted: 2022-09-13 - Earliest claimed: 2019-04-08 - Assignees: The United States of America as represented by the Secretary of the Air Force - Applicants: Government of the United States as represented by the Secretary of the Air Force - Inventors: Roberto S. Aga; Emily M. Heckman - Web page: https://patentgrep.com/patent/US11441956B1 ## CPC - G01L 1/18: using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) ## Abstract Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing or otherwise depositing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive. ## Claims ### Claim 1 A method for fabricating a strain sensing device directly on a structure, the method comprising: depositing a material on the structure, the material exhibiting a piezo-resistive effect; sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive after depositing the material onto the structure; and attaching a pin connector to the electrically conductive strain sensing pattern. ### Claim 2 (depends on 1) The method of claim 1, further comprising depositing an insulating layer on the structure. ### Claim 3 (depends on 1) The method of claim 1, further comprising drying the deposited material on the structure. ### Claim 4 (depends on 1) The method of claim 1, wherein the structure is a functional structure comprising one of a support beam and a wing of a vehicle. ### Claim 5 (depends on 1) The method of claim 1, wherein the structure is a curved structure. ### Claim 6 (depends on 5) The method of claim 5, further comprising mapping the curvature of the structure, wherein the depositing and sintering steps are configured to conform to a map of the curvature of the structure. ### Claim 7 (depends on 1) The method of claim 1, wherein the material comprises one of graphene, silver, and copper. ### Claim 8 (depends on 1) The method of claim 1, wherein the depositing includes using aerosol spray, a custom spray gun, rolling and/or painting material onto the structure. ### Claim 9 (depends on 1) The method of claim 1, wherein the sintering comprises a hand held laser engraving system, a heat gun, photonic means and/or focused hot air. ### Claim 10 (depends on 1) A strain sensing device manufactured directly on a structure by the method recited in claim 1. ### Claim 11 (depends on 10) The strain sensing device of claim 10, further comprising an insulating layer formed on the structure. ### Claim 12 (depends on 10) The strain sensing device of claim 10, further comprising a pin connector connected to the electrically conductive strain sensing pattern. ### Claim 13 (depends on 10) The strain sensing device of claim 10, wherein the structure is a functional structure comprising one of a support beam and a wing of a vehicle. ### Claim 14 (depends on 10) The strain sensing device of claim 10, wherein the material comprises one of graphene, silver, and copper. ### Claim 15 (depends on 10) The strain sensing device of claim 10, wherein sintering comprises one of thermal and laser sintering. ### Claim 16 A method for fabricating a strain sensing device directly on a structure, the method comprising: depositing a first material on the structure, the first material exhibiting a piezo-resistive effect; sintering a first strain sensing pattern from the first material such that the first strain sensing pattern becomes electrically conductive; depositing an insulating layer on the first material; depositing a second material on the insulating layer, the second material exhibiting a piezo-resistive effect; and sintering a second strain sensing pattern from the second material such that the second strain sensing pattern become electrically conductive. ### Claim 17 (depends on 16) The method of claim 16, further comprising depositing an insulating layer between the structure and first material. ### Claim 18 (depends on 16) The method of claim 16, wherein the depositing includes aerosol spray means, custom spray gun means, rolling and/or painting materials onto the structure. ### Claim 19 (depends on 16) The method of claim 16, further comprising attaching a pin connector to the electrically conductive first and second strain sensing patterns. ### Claim 20 (depends on 16) The method of claim 16, wherein the sintering comprises a hand held laser engraving system, a heat gun, photonic means and/or focused hot air. ### Claim 21 A method for fabricating a strain sensing device directly on a structure, the method comprising: depositing a material on the structure, the material exhibiting a piezo-resistive effect; sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive; attaching a pin connector to the electrically conductive strain sensing pattern; wherein the structure is a curved structure; and mapping the curvature of the structure, wherein the depositing and sintering steps are configured to conform to a map of the curvature of the structure.