# US 11,441,847 B2 · Evaporative cooling system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,441,847 B2 - Document ID: US11441847B2 - Status: Granted - Kind: B2 - Application number: 16/359,560 - Filed: 2019-03-20 - Published: 2019-09-26 - Granted: 2022-09-13 - Earliest claimed: 2018-03-20 - Assignees: Lenovo (Beijing) Limited - Applicants: Lenovo (Beijing) Co., Ltd. - Inventors: Ting Tian; Lianpei Zhang - Web page: https://patentgrep.com/patent/US11441847B2 ## CPC - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F25B 23/006: {boiling cooling systems} - F25B 39/022: {with plate-like or laminated elements} - H05K 7/20827: {within rooms for removing heat from cabinets, e.g. air conditioning devices} - F28D 15/0275: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores} - H10W 40/73: for cooling by change of state - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F25B: REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device. ## Claims ### Claim 1 An evaporative cooling system, comprising: a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device, wherein: the heat conducting device further comprises an evaporation chamber disposed inside a heat generating device having the heating element and a condensation chamber disposed above the evaporation chamber and extending out of the heat generating device to connect with an evaporator, the evaporation chamber and the condensation chamber being in communication with each other; and the heat dissipating device comprises an importing device configured to import a second medium in a liquid state into the evaporator, the import device including a liquid inlet tube extending through a wall of the heat dissipating device and a liquid inlet port formed at an end of the inlet tube of the heat dissipating device, and the evaporator is configured to receive heat from the heat conducting device to evaporate the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device. ### Claim 2 (depends on 1) The system according to claim 1, wherein: the evaporation chamber is capable of coupling to the heating element and contains the first medium, and the first medium is heated and flows to the condensation chamber; and the condensation chamber condenses the heated first medium, and returns the first medium to the evaporation chamber. ### Claim 3 (depends on 2) The system according to claim 2, wherein the inner walls of the evaporation chamber and the condensation chamber include a capillary structure to direct the first medium liquefied in the condensation chamber to the evaporation chamber. ### Claim 4 (depends on 1) The system according to claim 1, wherein the heat conducting device is arranged in relation to the evaporator through a pipe. ### Claim 5 (depends on 1) The system according to claim 1, wherein the evaporator is of one or more of the following structures: an S-shaped structure, a grid structure, a plate structure, and a honeycomb structure. ### Claim 6 (depends on 1) The system according to claim 1, wherein the one or more heat dissipating outlets of the heat dissipating device are arranged in relation to an enclosed channel for discharging the heated second medium. ### Claim 7 An evaporative cooling method, comprising: transferring heat by a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; dissipating heat by a heat dissipating device having one or more heat dissipating outlets; receiving heat by an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device, the heat dissipating device comprises an importing device configured to import a second medium in a liquid state into the evaporator, the import device including a liquid inlet tube extending through a wall of the heat dissipating device and a liquid inlet port formed at an end of the inlet tube of the heat dissipating device; and evaporating, by the evaporator, the second medium of the heat dissipating device with the heat received from the heat conducting device and discharging the heat by the evaporator from the one or more heat dissipating outlets of the heat dissipating device, wherein: the heat conducting device further comprises an evaporation chamber disposed inside a heat generating device having the heating element and a condensation chamber disposed above the evaporation chamber and extending out of the heat generating device to connect with an evaporator, the evaporation chamber and the condensation chamber being in communication with each other. ### Claim 8 (depends on 7) The method according to claim 7, wherein the heat conducting device further comprising: the evaporation chamber being capable of coupling to the heating element and containing the first medium, and the first medium being heated and flowing to the condensation chamber; and the condensation chamber being arranged in relation to the evaporator, condensing the heated first medium, and returning the first medium to the evaporation chamber. ### Claim 9 (depends on 7) The method according to claim 7, wherein the inner walls of the evaporation chamber and the condensation chamber include a capillary structure to direct the first medium liquefied in the condensation chamber to the evaporation chamber. ### Claim 10 (depends on 7) The method according to claim 7, wherein the heat conducting device is arranged in relation to the evaporator through a pipe. ### Claim 11 (depends on 7) The method according to claim 7, wherein the evaporator is of one or more of the following structures: an S-shaped structure, a grid structure, a plate structure, and a honeycomb structure. ### Claim 12 An apparatus comprising a cooling system, the cooling system comprising: a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled, and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets, and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device; wherein: the heat conducting device further comprises an evaporation chamber disposed inside a heat generating device having the heating element and a condensation chamber disposed above the evaporation chamber and extending out of the heat generating device to connect with an evaporator, the evaporation chamber and the condensation chamber being in communication with each other; and the heat dissipating device comprises an importing device configured to import a second medium in a liquid state into the evaporator, the importing device including a liquid inlet tube extending through a wall of the heat dissipating device and a liquid inlet port formed at an end of the inlet tube of the heat dissipating device, and the evaporator is configured to receive heat from the heat conducting device to evaporate the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device. ### Claim 13 (depends on 12) The apparatus according to claim 12, wherein: the evaporation chamber is capable of coupling to the heating element and contains the first medium, and the first medium is heated and flows to the condensation chamber; the condensation chamber condenses the heated first medium, and returns the first medium to the evaporation chamber.