Back to results
US 11,441,825 B2Granted
Nano-porous based thermal enclosure with heat removal
AssigneeHoneywell International Inc.
InventorsSteven J. Eickhoff, Paul Bryant Koeneman, Jeffrey Michael Klein, Wei Yang, Jong Park, Gustav Rustan
Life of this patent
Estimating the term…
Abstract
A cooling system includes a dual plate structure having a porous material disposed between the plates such that the porous material is sealed from ambient at a pressure less than ambient. A cooling device is thermally coupled to a mobile device supported by the structure and actively removes heat from the mobile device.
Claims19
A cooling device comprising;
- an evaporator configured to thermally couple to a surface of a mobile device;
- a condenser configured to be exposed to atmosphere;
- a pump disposed within the cooling device;
- a thermally insulating plate disposed between the evaporator and the condenser, wherein the thermally insulating plate comprises a cradle sized to fit a back surface of the mobile device, wherein the cradle includes an opening, wherein the condenser forms a back surface of the cooling device and is configured to be exposed to atmosphere, wherein the thermally insulating plate forms a bottom of the opening, and wherein the opening is configured to provide access to a front interface surface of the mobile device;
- and
- fluidics to couple the evaporator, condenser and pump in a fluidic loop configured to cool the mobile device.
3 more elements
A cooling system comprising;
- a dual plate enclosure having a fumed silica based porous material disposed between the plates such that the porous material is sealed from ambient at a pressure less than ambient;
- and
- an active cooling thermal loop comprising a condenser and an evaporator, the active cooling thermal loop coupled to a mobile device to remove heat from the mobile device placed in the dual plate enclosure, wherein the dual plate enclosure provides insulation for the mobile device and separates the condenser from the evaporator.
A method comprising:
- supporting a heat generating mobile device by a thermally coupled evaporator;
- and
- pumping a working fluid through a fluidic loop comprising a pump, the evaporator, and a condenser to remove heat from the mobile device, wherein the condenser is separated from the evaporator by a thermally insulating plate, wherein the thermally insulating plate comprises a cradle sized to fit a back surface of the mobile device, wherein the cradle includes an opening, wherein the condenser forms a back surface of the cooling device and is configured to be exposed to atmosphere, wherein the thermally insulating plate forms a bottom of the opening, and wherein the opening is configured to provide access to a front interface surface of the mobile device.
Dependencies are inferred from the claim text.