# US 11,441,011 B2 · Thermally conductive molded resin article

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- Number: US 11,441,011 B2
- Document ID: US11441011B2
- Status: Granted
- Kind: B2
- Application number: 16/074,335
- Filed: 2017-01-31
- Published: 2021-06-03
- Granted: 2022-09-13
- Earliest claimed: 2016-02-01
- Assignees: Bando Chemical Industries, Ltd.
- Applicants: Bando Chemical Industries, Ltd.
- Inventors: Fumihiro Mukai; Kotaro Yamaura; Hiroki Naito; Yasuhiro Sako
- Web page: https://patentgrep.com/patent/US11441011B2

## CPC

- C08K 3/38: Boron-containing compounds
- C08K 3/00: Use of inorganic substances as compounding ingredients
- C08K 3/22: of metals
- C08L 27/12: containing fluorine atoms
- C08L 33/08: Homopolymers or copolymers of acrylic acid esters
- C08L 83/04: Polysiloxanes
- C09K 5/14: Solid materials, e.g. powdery or granular
- H10H 20/8581: {characterised by their material}
- H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- C08K 2003/2227: {of aluminium}
- C08K 2003/382: {and nitrogen}
- C08K 2201/001: Conductive additives
- C08K 2201/005: Additives being defined by their particle size in general
- C08K 2201/014: Additives containing two or more different additives of the same subgroup in C08K
- C08K 2201/016: Additives defined by their aspect ratio
- H10W 40/25: characterised by their materials
- H10W 40/251: {Organics}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 40/259: {Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.

## Claims

### Claim 1

A thermally conductive molded resin sheet article having a length, a width, and a thickness perpendicular to the length and width, which comprises
a resin and
thermally conductive fillers including
a first thermally conductive filler and
a second thermally conductive filler having a smaller particle size than the first thermally conductive filler;
the first thermally conductive filler has an aspect ratio of 10 or more and is oriented in the thickness direction of the thermally conductive molded resin article;
the resin is a silicone resin, an acrylic rubber, or a fluororubber; and
the second thermally conductive filler has a thermal conductivity of more than 5 W/mK;
wherein a weld line of the resin is formed in the thickness direction of the thermally conductive molded resin article.

### Claim 2

A method of forming a thermally conductive molded resin sheet article having a length, a width, and a thickness perpendicular to the length and width, comprising the steps of
providing a composition that comprises
a resin and
thermally conductive fillers including
a first thermally conductive filler and
a second thermally conductive filler having a smaller particle size than the first thermally conductive filler;
wherein
the first thermally conductive filler has an aspect ratio of 10 or more;
the resin is a silicone resin, an acrylic rubber, or a fluororubber; and
the second thermally conductive filler has a thermal conductivity of more than 5 W/mK, and
conducting extrusion molding of the composition to form a thermally conductive molded resin article,
wherein the first thermally conductive filler is oriented in the thickness direction of the thermally conductive molded resin article, and
wherein a weld line of the resin is formed in the thickness direction of the thermally conductive molded resin article.