# US 11,440,990 B2 · Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

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- Number: US 11,440,990 B2
- Document ID: US11440990B2
- Status: Granted
- Kind: B2
- Application number: 16/651,039
- Filed: 2017-09-29
- Published: 2020-08-06
- Granted: 2022-09-13
- Earliest claimed: 2017-09-29
- Assignees: Showa Denko Materials Co., Ltd.
- Applicants: Showa Denko Materials Co., Ltd.
- Inventors: Yuka Yoshida; Naoki Maruyama; Tomoko Higashiuchi; Kazumasa Fukuda; Keiichiro Nishimura; Yoshitaka Takezawa
- Web page: https://patentgrep.com/patent/US11440990B2

## CPC

- C08G 59/245: {aromatic}
- C09K 19/04: characterised by the chemical structure of the liquid crystal components {, e.g. by a specific unit}
- C08G 59/066: {with chain extension or advancing agents}
- C08G 59/184: {with amines}
- C08G 59/24: carbocyclic
- C08G 59/50: Amines
- C08G 59/621: {Phenols}
- C08G 59/688: {containing phosphorus}
- C08K 3/04: Carbon
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09K 2019/0448: {the end chain group being a polymerizable end group, e.g. -Sp-P or acrylate}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)

## Abstract

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

## Claims

### Claim 1

An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group, wherein the at least two mesogenic structures are mesogenic structures represented by the following Formula (3):
wherein, in Formula (3), each of R3 to R6 independently represents a hydrogen atom.

### Claim 2 (depends on 1)

The epoxy resin according to claim 1, wherein the epoxy compound has a structure in which the divalent biphenyl group is disposed between the at least two mesogenic structures.

### Claim 3 (depends on 1)

The epoxy resin according to claim 1, further comprising a mesogenic epoxy monomer represented by the following Formula (1-m):
wherein, in Formula (1-m), X represents a single bond or a linking group that includes at least one divalent group selected from the following Group (A):
wherein, in Group (A), each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; each n independently represents an integer from 0 to 4; k represents an integer from 0 to 7; m represents an integer from 0 to 8; and 1 represents an integer from 0 to 12.

### Claim 4 (depends on 3)

The epoxy resin according to claim 3, wherein the mesogenic epoxy monomer represented by Formula (1-m) includes a mesogenic epoxy monomer represented by the following Formula (2-m):
wherein, in Formula (1-m), X represents a single bond or a linking group that includes at least one divalent group selected from the Group (A); each Y independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group or an acetyl group; and each n independently represents an integer from 0 to 4.

### Claim 5 (depends on 3)

The epoxy resin according to claim 3, wherein the mesogenic epoxy monomer represented by Formula (1-m) includes a mesogenic epoxy monomer represented by the following Formula (3-m) or Formula (4-m):
wherein, in Formula (3-m) and Formula (4-m), each of R3 to R6 independently represents a hydrogen atom or an alkyl group of 1 to 3 carbon atoms.

### Claim 6 (depends on 3)

The epoxy resin according to claim 3, wherein the mesogenic epoxy monomer is included in an amount of 50% or less with respect to a total amount of the epoxy resin.

### Claim 7 (depends on 1)

An epoxy resin composition, comprising the epoxy resin according to claim 1, and a curing agent.

### Claim 8 (depends on 7)

The epoxy resin composition according to claim 7, which is configured to form a smectic structure in a cured state.

### Claim 9 (depends on 7)

The epoxy resin composition according to claim 7, wherein the curing agent includes a compound having two or more amino groups that are directly bonded to an aromatic ring.

### Claim 10 (depends on 7)

The epoxy resin composition according to claim 7, wherein the curing agent is 3,3′-diaminodiphenylsulfone.

### Claim 11 (depends on 7)

An epoxy resin cured product, comprising a cured product of the epoxy resin composition according to claim 7.

### Claim 12 (depends on 11)

A composite material, comprising the epoxy resin cured product according to claim 11 and a reinforcing material.

### Claim 13 (depends on 12)

The composite material according to claim 12, wherein the reinforcing material includes a carbon material.