# US 11,440,793 B2 · Hydrogen sensor on medium or low temperature solid micro heating platform > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,440,793 B2 - Document ID: US11440793B2 - Status: Granted - Kind: B2 - Application number: 16/726,272 - Filed: 2019-12-24 - Published: 2020-07-30 - Granted: 2022-09-13 - Earliest claimed: 2019-01-25 - Assignees: Shanghai Jiaotong University - Applicants: Shanghai Jiaotong University - Inventors: Guifu Ding; Qi Liu; Yan Wang; Yunna Sun - Web page: https://patentgrep.com/patent/US11440793B2 ## CPC - B81B 7/0087: {On-device systems and sensors for controlling, regulating or monitoring} - B81B 7/0019: {Protection against thermal alteration or destruction (B81B7/0083 takes precedence)} - B81B 7/0096: {by heating} - G01N 33/005: {H2} - B81B 2201/0214: Biosensors; Chemical sensors - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) ## Abstract Described herein is a hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and thermally and electrically isolated from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure; and a sensitive layer disposed on the thermal-conducting layer. The sensitive layer can be heated to a set temperature by the heating structure to improve sensitivity and reduce the response time. ## Claims ### Claim 1 A hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and isolated, thermally and electrically, from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure, wherein the thermal-conducting layer has a patterned structure to reduce the area of the thermal-conducting layer covering the heating structure, thereby reducing the heat dissipation; and a sensitive layer disposed on the thermal-conducting layer, wherein the sensitive layer is heated to a set temperature by the heating structure to improve sensitivity and reduce the response time, wherein the material of the sensitive layer is a hydrogen-sensitive material including palladium (Pd) or palladium-based alloy. ### Claim 2 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the material of the substrate is glass, ceramics, or organic substrate. ### Claim 3 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the thermal-insulating layer is disposed on the bottom and sides of the heating structure. ### Claim 4 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the material of the thermal-insulating layer is an insulating material having a thermal conductivity of less than 0.12 W/(m*K); wherein the material of the thermal-insulating layer is organic colloid doped with inorganic nanoparticles or whiskers of low thermal conductivity; or wherein the material of the thermal-insulating layer is polyimide doped with 2 wt %-10 wt % nano silicon dioxide with a thickness of 30 microns to 100 microns. ### Claim 5 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the heating structure is a heating wire or a heating film. ### Claim 6 (depends on 5) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 5, wherein the heating structure is a platinum (Pt) heating wire with a line width of 5 microns to 10 microns, and a thickness of 100 nanometers to 300 nanometers. ### Claim 7 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the material of the thermal-conducting layer is an insulating material having a thermal conductivity of more than 1.5 W/(m*K); wherein the material of the thermal-conducting layer is organic colloid doped with inorganic nanoparticles or whiskers of high thermal conductivity; or wherein the material of the thermal-conducting layer is polyimide doped with 2 wt %-10 wt % nano silicon carbide whiskers with a thickness of 4 microns to 10 microns. ### Claim 8 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein thickness of the sensitive layer is from 50 nanometers to 200 nanometers. ### Claim 9 (depends on 1) The hydrogen sensor on medium or low temperature solid micro heating platform of claim 1, wherein the operating temperature of the hydrogen sensor is no more than 350° C. ### Claim 10 A hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate, wherein the material of the thermal-insulating layer is an insulating material having a thermal conductivity of less than 0.12 W/(m*K); wherein the material of the thermal-insulating layer is organic colloid doped with inorganic nanoparticles or whiskers of low thermal conductivity; or wherein the material of the thermal-insulating layer is polyimide doped with 2 wt %-10 wt % nano silicon dioxide with a thickness of 30 microns to 100 microns; a heating structure disposed above the thermal-insulating layer, and isolated, thermally and electrically, from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure; and a sensitive layer disposed on the thermal-conducting layer, wherein the sensitive layer is heated to a set temperature by the heating structure to improve sensitivity and reduce the response time, wherein the material of the sensitive layer is a hydrogen-sensitive material including palladium (Pd) or palladium-based alloy. ### Claim 11 A hydrogen sensor on medium or low temperature solid micro heating platform, comprising: a substrate; a thermal-insulating layer disposed above the substrate; a heating structure disposed above the thermal-insulating layer, and isolated, thermally and electrically, from the substrate by the thermal-insulating layer; a thermal-conducting layer covering the heating structure, wherein the material of the thermal-conducting layer is an insulating material having a thermal conductivity of more than 1.5 W/(m*K); wherein the material of the thermal-conducting layer is organic colloid doped with inorganic nanoparticles or whiskers of high thermal conductivity; or wherein the material of the thermal-conducting layer is polyimide doped with 2 wt %-10 wt % nano silicon carbide whiskers with a thickness of 4 microns to 10 microns; and a sensitive layer disposed on the thermal-conducting layer, wherein the sensitive layer is heated to a set temperature by the heating structure to improve sensitivity and reduce the response time, wherein the material of the sensitive layer is a hydrogen-sensitive material including palladium (Pd) or palladium-based alloy.