# US 11,440,310 B2 · Method for producing a substrate adapter and substrate adapter for connecting to an electronic component

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,440,310 B2
- Document ID: US11440310B2
- Status: Granted
- Kind: B2
- Application number: 16/704,145
- Filed: 2019-12-05
- Published: 2020-06-11
- Granted: 2022-09-13
- Earliest claimed: 2018-12-06
- Assignees: Heraeus Deutschland GmbH & Co. KG
- Applicants: Heraeus Deutschland GmbH & Co. KG
- Inventors: Andreas Steffen Klein; Andreas Hinrich; Michael Schaefer; Yvonne Loewer; Wolfgang Schmitt; Michael Lemmer
- Web page: https://patentgrep.com/patent/US11440310B2

## CPC

- B32B 43/006: {Delaminating}
- H10W 72/013: {of die-attach connectors}
- H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)}
- B29C 65/76: Making non-permanent or releasable joints
- B29C 66/02: {Preparation of the material, in the area to be joined, prior to joining or welding (B29C66/32 takes precedence)}
- B29C 66/022: {Mechanical pre-treatments, e.g. reshaping}
- B29C 66/0222: {without removal of material, e.g. cleaning by air blowing or using brushes}
- B29C 66/43: {Joining a relatively small portion of the surface of said articles (B29C66/45 takes precedence)}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)

## Abstract

One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

## Claims

### Claim 1

A method for producing a substrate adapter for connecting to an electronic component, comprising:
arranging at least one contacting material layer on a surface of a substrate and between at least one side of a carrier and the surface of the substrate such that the at least one contacting material layer has at least one predetermined breaking point;
joining the carrier and the substrate to the at least one contacting material layer;
wherein the carrier comprises at least one adhesive layer with a substantially constant adhesive force over the surface of the carrier; and
wherein the at least one contacting material layer comprises at least one of a sinter material, a sinter paste, and a sinter foil;
wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer with a plurality of material recesses in the at least one contacting material layer thereby forming the at least one predetermined breaking point, wherein the plurality of material recesses are situated on a surface of the at least one contacting material layer or face toward the carrier; and
lifting off and detaching the substrate with the contacting material layer arranged thereon, the contacting material layer breaks off along the predetermined breaking point.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer at least for a portion in the form of three-dimensional structures in a form comprising one of pyramid-shaped, sphere-shaped, cube-shaped, torus-shaped, cylinder-shaped, and cone-shaped structures, wherein the plurality of material recesses are formed of at least one space between adjacent three-dimensional structures.

### Claim 3 (depends on 2)

The method according to claim 2, wherein the arranging of the at least one contacting material layer comprises evenly spaced arranging, of the three-dimensional structures along a first axis of extension and a second axis of extension, wherein the first and the second axis of extension are situated at an angle of substantially 90° to each other.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the arranging of the at least one contacting material layer comprises arranging the at least one contacting material layer on the carrier by pressing, comprising at least one of silk screening, spraying on, and doctor blading, or arranging the at least one contacting material layer on the carrier by embossing with a stamp or a profiled roller.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the at least one contacting material layer comprises at least one of an adhesive, a solder, a silver, a silver alloy, a copper, and a copper alloy.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the method comprises detaching the substrate adapter with a gripping or suctioning device, substantially along the at least one predetermined breaking point between the contacting material layer and the carrier.

### Claim 7 (depends on 1)

The method according to claim 1, comprising separating the substrate and the carrier joined to the at least one contacting material layer after the joining of the carrier and the substrate to the at least one contacting material layer, dividing, prior to the detaching of the substrate joined to the at least one contacting material layer, into at least two with separating of shaped parts of the substrate joined to the contacting material layer, into a plurality of shaped parts by means of sawing, stamping, and/or etching.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the substrate comprises one of a metal element, a metal foil, and a copper foil.

### Claim 9

A substrate adapter for connecting to an electronic component, comprising:
a carrier;
a substrate; and
a contacting material layer comprising at least one of a sinter material, a sinter paste, and a sinter foil;
wherein the contacting material layer is arranged on a surface of the substrate between at least one side of the carrier and the surface of the substrate;
wherein the contacting material layer has at least one predetermined breaking point;
wherein the carrier comprises at least one adhesive layer with a substantially constant adhesive force over the surface of the carrier;
wherein the carrier and the substrate are joined to the contacting material layer;
wherein the contacting material layer comprises a plurality of recesses in the contacting material layer in order to form the predetermined breaking point, the material recesses situated on a surface of the contacting material layer or facing toward the carrier; and
wherein the at least one predetermined breaking point is configured such that lifting off and detaching the substrate causes the contacting material layer to break off along the predetermined breaking point.

### Claim 10 (depends on 9)

The substrate adapter according to claim 9, wherein the contacting material layer is arranged at least for a portion in the form of three-dimensional structures comprising at least one of pyramid-shaped, sphere-shaped, cube-shaped, torus-shaped, cylinder-shaped, and cone-shaped structures, wherein the material recesses are formed of at least one space between adjacent three-dimensional structures.

### Claim 11 (depends on 10)

The substrate adapter according to claim 10, wherein the three-dimensional structures are arranged, evenly spaced, along a first axis of extension and a second axis of extension, wherein the first and the second axis of extension are situated at an angle of substantially 90° to each other.

### Claim 12 (depends on 9)

The substrate adapter according to claim 9, wherein the contacting material layer comprises an adhesive, a solder, a sinter foil comprising one of a silver, a silver alloy, a copper, and a copper alloy.