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US 11,440,303 B2Granted
Laminate and method of manufacturing same
AssigneeZeon Corporation
InventorsRyuta Kurihara, Daido Chiba
Life of this patent
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Abstract
Disclosed is a laminate which includes one or more soft layers and an electronic device enclosed by the one or more soft layers, wherein the one or more soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m2·24 h)·100 μm] or less.
Claims9
A laminate comprising a first soft layer, a second soft layer, a third soft layer, a fourth soft layer, and an electronic device enclosed by the first to fourth soft layers,
- wherein the first to fourth soft layers each directly contact the electronic device,
- the first soft layer is positioned on one side of the electronic device,
- the second soft layer is positioned on the other side of the electronic device,
- the first and second soft layers are different soft layers and each comprise a thermoplastic resin,
- the thermoplastic resin comprises as a main component a modified hydrogenated block copolymer [E] in which an alkoxysilyl group is introduced to a hydrogenated block copolymer [D], the hydrogenated block copolymer [D] being obtained by hydrogenating a block copolymer [C] which comprises:
- a polymer block [A] which comprises as a main component a structural unit derived from an aromatic vinyl compound;
- and a polymer block [B] which comprises as a main component a structural unit derived from a chain conjugated diene compound, and
- wherein the first to fourth soft layers have a flexural modulus of 80 MPa or more and 1,000 MPa or less and a water vapor permeability at 40° C. and 90% RH of 15 [g/(m2·24h)·100 μm] or less.
5 more elements
Dependencies are inferred from the claim text.