# US 11,440,158 B2 · Coated compressive subpad for chemical mechanical polishing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,440,158 B2 - Document ID: US11440158B2 - Status: Granted - Kind: B2 - Application number: 15/875,773 - Filed: 2018-01-19 - Published: 2018-05-24 - Granted: 2022-09-13 - Earliest claimed: 2014-11-21 - Assignees: CMC Materials, Inc. - Applicants: Cabot Microelectronics Corporation - Inventors: Diane Scott; Paul Andre Lefevre - Web page: https://patentgrep.com/patent/US11440158B2 ## CPC - B24B 37/22: characterised by a multi-layered structure - B24B 37/24: characterised by the composition or properties of the pad materials - B24D 18/0072: {using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing} - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - B24D: TOOLS FOR GRINDING, BUFFING OR SHARPENING (abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls B24B31/14; honing tools B24B33/08; lapping tools B24B37/11) ## Abstract Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer. ## Claims ### Claim 1 A subpad for a polishing pad stack, the subpad comprising: a compressive subpad material having a first surface and a second, opposite, surface; a first pressure sensitive adhesive layer coated on the first surface of the compressive subpad material, and a first release liner disposed on the first pressure sensitive adhesive layer; and a second pressure sensitive adhesive layer coated on the second surface of the compressive subpad material, wherein the compressive subpad material is a compressive foam subpad material, and wherein the first and second surfaces of the compressive foam subpad material each have a surface energy approximately in the range of 30-40 dyne/cm2, and the first pressure sensitive adhesive layer is in direct contact with at least 90% of the total surface area of the first surface of the compressive subpad material. ### Claim 2 (depends on 1) The subpad of claim 1, further comprising: a second release liner disposed on the second pressure sensitive adhesive layer. ### Claim 3 (depends on 1) The subpad of claim 1, wherein the first pressure sensitive adhesive layer is a removable pressure sensitive adhesive layer, and wherein the second pressure sensitive adhesive layer is a permanent pressure sensitive adhesive layer. ### Claim 4 (depends on 3) The subpad of claim 3, wherein the permanent pressure sensitive adhesive layer is for coupling to a hack surface of a polishing pad, and wherein the removable pressure sensitive adhesive layer is for coupling the subpad to a platen of a chemical mechanical polishing apparatus. ### Claim 5 (depends on 1) The subpad of claim 1, wherein the second pressure sensitive adhesive layer has a peel strength of greater than approximately 4.5 pounds per inch at 25 degrees Celsius, and wherein the first pressure sensitive adhesive layer has a peel strength of less than approximately 4 pounds per inch at 25 degrees Celsius. ### Claim 6 (depends on 1) The subpad of claim 1, wherein the compressive subpad material is a compressive foam subpad material comprising a material selected from the group consisting of an ethylene vinyl acetate closed cell foam material, a polyethylene closed cell foam material, and a polyurethane mostly closed cell foam material. ### Claim 7 (depends on 1) The subpad of claim 1, wherein the compressive subpad material has a thickness approximately in the range of 10 mils to 40 mils. ### Claim 8 (depends on 1) The subpad of claim 1, wherein the second pressure sensitive adhesive layer comprises a first material selected from the group consisting of an acrylic material, a rubber, ethylene vinyl acetate, a silicone material, and a block co-polymer, and wherein the first pressure sensitive adhesive layer comprises a second material selected from the group consisting of an acrylic material, a rubber, ethylene vinyl acetate, a silicone material, and a block co-polymer. ### Claim 9 (depends on 1) The subpad of claim 1, wherein the first surface of the compressive subpad material has a surface roughness of at least 3 microns and has a total surface area, and the first pressure sensitive adhesive layer is in direct contact with at least 95% of the total surface area of the first surface of the compressive subpad material. ### Claim 10 (depends on 9) The subpad of claim 9, wherein the second surface of the compressive subpad material has a surface roughness of at least 3 microns and has a total surface area, and the second pressure sensitive adhesive layer is in direct contact with at least 90% of the total surface area of the second surface of the compressive subpad material.