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US 11,439,154 B2Granted
Noodle band cutting apparatus
AssigneeYutaka Mfg. Co., Ltd.
InventorMasayasu Kurachi
Life of this patent
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Abstract
A noodle band cutting apparatus for cutting a noodle band having a predetermined thickness and a predetermined width with cutting devices comprises a moving mechanism and plural cutting devices. One cutting device is selected from the plural cutting devices. The selected one pair of the cutting devices is moved and fixed at a position to cut the noodle band within the moving mechanism.
Claims4
A noodle band cutting apparatus for cutting noodle bands having a predetermined thickness and width, comprising:
- a moving mechanism;
- and
- plural cutting devices,
- wherein one of the cutting devices is selected from the plural cutting devices by being moved and being fixed at a noodle band cutting position,
- wherein the moving mechanism includes a drum having a pair of circular edge plates, and a plurality of frames connecting the edge plates, a rod provided at a center of the drum, and a handle connected to an edge portion of the rod,
- wherein the drum is configured to rotate around the rod by rotating the handle,
- wherein the edge plates have a number of notches equal to that of the number of cutting devices,
- wherein the notches are formed to extend in a radial direction of the edge plates, and open at a circumferential side thereof, and
- wherein both longitudinal ends of the plural cutting devices are supported in the notches of the edge plates.
6 more elements
Dependencies are inferred from the claim text.