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US 11,437,739 B2Granted
Connector pre-filled with sealant
AssigneeKYOCERA Corporation
InventorsTetsuya Hata, Shigeki Ohara
Life of this patent
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Abstract
A connector (10) configured to bring an object (70) into conduction comprises: a pair of fitting bodies fittable to each other; and a filler (60) with which at least one fitting body of the pair of fitting bodies is loaded, wherein a fitting body of the pair of fitting bodies includes: an accommodating portion (35a) configured to accommodate the object (70) together with the filler (60); and a receiving portion (36) configured to be adjacent to the accommodating portion (35a) and receive the filler (60).
Claims7
A connector configured to bring an object into conduction, the connector comprising:
- a pair of fitting bodies comprising a first housing and a second housing fittable to each other;
- and
- a filler with which said first housing and said second housing are loaded,
- wherein said second housing includes:
- an accommodating portion formed inside said second housing, including a bottom surface, and configured to surround said object together with said filler, said bottom surface of said accommodating portion facing an end surface in an extending direction of said object;
- and
- a receiving portion in an outer surface of the second housing and adjacent to said accommodating portion is in communication with the accommodating portion through an opening therebetween such that at least a portion of said filler in the accommodating portion may move to the receiving portion.
4 more elements
Dependencies are inferred from the claim text.