A chip testing system, configured to perform a testing operation to a plurality of chips, comprising:
- a chip tray kit including:
- a tray having a plurality of tray thru-holes each penetrating through the tray;
- a plurality of chip fixing members detachably fixed to the tray, wherein each of the chip fixing members is arranged in the corresponding one of the tray thru-holes, each of the chip fixing members includes a plurality of fixing thru-holes and a plurality of chip accommodating slots, each of the fixing thru-holes penetrates through the chip fixing member, each of the chip accommodating slots is in spatial communication with the corresponding one of the fixing thru-holes, each of the chip accommodating slots is configured to accommodate one of the chips, and a plurality of connection portions of the chip accommodated in the corresponding one of the chip accommodating slots are fixed through the chip;
- and
- a plurality of auxiliary insertion members detachably fixed to a side of the chip fixing members, wherein each of the auxiliary insertion members is configured to limit a movement range of the chips in the corresponding one of the chip fixing members relative to the chip fixing member, and wherein each of the auxiliary insertion members includes a plurality of insertion thru-holes, and when each of the auxiliary insertion members is fixed to the side of the chip fixing members, each of the insertion thru-holes is in spatial communication with the corresponding one of the chip accommodating slots;
- an insertion member mounting apparatus configured to mount the auxiliary insertion members onto the side of the chip fixing members;
- a chip testing apparatus including:
- at least one testing machine configured to be connected to the chip tray kit, wherein the at least one testing machine is configured to perform the testing operation to the chips carried by the chip tray kit;
- at least one lid having an accommodating slot formed at one side thereof, wherein the at least one lid is configured to cover a side of the tray;
- a plurality of pressing assemblies disposed on the at least one lid, wherein each of the pressing assemblies is arranged in the accommodating slot of the at least one lid, and the pressing assemblies are configured to press a plurality of surfaces of the chips carried by the chip fixing members of the chip tray kit;
- and
- a temperature adjusting device connected to the pressing assemblies, wherein the temperature adjusting device is configured to allow a temperature of each of the pressing assemblies to reach a predetermined temperature;
- an insertion member detaching apparatus configured to detach the auxiliary insertion members from the side of the chip fixing members;
- and
- a conveying apparatus configured to convey the chip tray kit.