Resin sheet and adhesive-layer-having resin sheet
AssigneeNitto Denko Corporation
InventorsYusuke Yamanari, Makoto Saito, Akira Hirao, Kenji Furuta
Life of this patent
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Abstract
A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.
Claims7
A resin sheet, comprising a resin foam and having a main surface A and a main surface B opposite to each other across a thickness “d”,
- wherein the resin sheet has a thermal conductivity of from 0.08 W/m·K to 0.35 W/m·K;
- wherein the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999;
- wherein the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less;
- and
- wherein the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.
Dependencies are inferred from the claim text.