Injection molding a device such as a cable holder with an integrated wireless tagging foil
AssigneeAptiv Technologies AG
InventorsFarshad Miraboutalebi, Hagen Spiess
Life of this patent
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AssigneeAptiv Technologies AG
InventorsFarshad Miraboutalebi, Hagen Spiess
Estimating the term…
The disclosure relates to a method for injection-molding a device, in particular a cable tie, with an integrated wireless tag, comprising the method steps of a) putting a tagging foil with two main surfaces which are separated by an edge, into a mold cavity of an open mold, where the tagging foil is held in place by a supporting device; b) closing the mold; c) injecting an injection material into the mold cavity parts adjoining the two main surfaces of the tagging foil simultaneously and symmetrically with respect to a main extension plane of the tagging foil which is parallel to the two main surfaces of the tagging foil so as to simplify and speed up the manufacturing process of a device with an integrated wireless tag or label. The disclosure furthermore relates to a corresponding molding device as well as a corresponding device with an integrated wireless tag.
A method for injection-molding a device with an integrated wireless tag, the method comprising:
Dependencies are inferred from the claim text.