High-density connecting device

A high-density connecting device, comprising:

• a first connecting module including a first casing assembly, a first circuit board, and a first socket connector, the first socket connector being disposed on one surface of the first circuit board and being electrically connected to the first circuit board, the first circuit board and the first socket connector being disposed in the first casing assembly, a first junction end being formed at one end of the first circuit board, a plurality of first contacts being disposed on at least one surface of the first junction end, the first socket connector being arranged in proximity to the first junction end on the one surface of the first circuit board;
• and
• a second connecting module including a second casing assembly, a second circuit board, and a second socket connector, the second socket connector being disposed on one surface of the second circuit board and being electrically connected to the second circuit board, the second circuit board and the second socket connector being disposed in the second casing assembly, a second junction end being formed at one end of the second circuit board, a plurality of second contacts being disposed on at least one surface of the second junction end, the second socket connector being arranged in proximity to the second junction end on the one surface of the second circuit board;
• wherein, when the first connecting module is mated with the second connecting module, the first junction end of the first circuit board is inserted into the second socket connector, so that the first junction end of the first circuit board is electrically connected to the second socket connector, and the second junction end of the second circuit board is inserted into the first socket connector, so that the second junction end of the second circuit board is electrically connected to the first socket connector.