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US 11,424,140 B2Granted
Member, method of manufacturing the same, apparatus for manufacturing the same, and semiconductor manufacturing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsChanghwan Kim, Toshihiro Iizuka, Kenichi Nagayama, Takafumi Noguchi
Life of this patent
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Abstract
A member includes a base material structure and a surface layer on the base material structure. The surface layer includes a particle that includes Y—O—F. The base material structure includes interface layers in contact with the surface layer. The interface layers of the base material structure include fluorine.
Claims6
A manufacturing apparatus for a member, the manufacturing apparatus comprising:
- a chamber that includes a base material structure, wherein the base material structure includes a planar surface, and a surface layer formed on the planar surface;
- and
- a nozzle disposed in the chamber,
- wherein the nozzle is open inside of the chamber,
- wherein the nozzle sprays a raw material powder onto the planar surface to form the surface layer, and
- wherein a particle incident angle formed by a spray axis of the raw material powder and the planar surface is equal to or less than 30 degrees,
- wherein the surface layer includes a particle that includes Y—O—F,
- wherein the base material structure includes an interface layer in contact with the surface layer and a base body in contact with the interface layer thereof, wherein the interface layer of the base material structure includes a first layer and a second layer,
- wherein the interface layer of the base material structure includes fluorine,
- wherein the second layer is closer to the base body than the first layer, and
- wherein the second layer has a fluorine content that is greater than that of the first layer.
8 more elements
Dependencies are inferred from the claim text.