Apparatus and method for removing bubbles in flexible substrate
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorHaiyang Shen
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Abstract
The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.
Claims9
An apparatus for removing a plurality of bubbles in a flexible substrate, wherein the flexible substrate includes a baseplate and a polyimide layer coated on the baseplate, the apparatus comprising:
- a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space;
- a heating plate disposed in the accommodation space;
- and
- a cooling conduit embedded in both the top wall and the sidewall of the chamber;
- wherein the cooling conduit includes a cooling fluid circulating therein, and the cooling fluid is maintained at about room temperature.
An apparatus for removing a plurality of bubbles in a flexible substrate, wherein the flexible substrate includes a baseplate and a polyimide layer coated on the baseplate, the apparatus comprising:
- a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space;
- a heating plate disposed in the accommodation space;
- and
- a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.
Dependencies are inferred from the claim text.