Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsToshifumi Matsushima, Tetsuro Sato
Life of this patent
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Abstract
An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.
Claims11
A resin composition used for constituting a resin layer of a laminate in which the resin layer is provided on a metal layer surface, the resin composition comprising
- a styrene-modified polyphenylene ether compound obtained from reacting a polyphenylene ether compound with chloromethyl styrene;
- 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer;
- 0.1 parts by mass to 100 parts by mass of a component promoting solubility of the resin composition with a desmear solution, wherein the component is a polymer of diallyl phthalate;
- and
- 0.1 parts by mass to 30 parts by mass of a curl lessening component selected from the group consisting of
- 2,4-diphenyl-4-methyl-1-pentene,
- lauryl mercaptan,
- octyl mercaptan,
- 2-mercaptoethanol,
- octyl thioglycolate, and
- 3-mercaptopropionic acid,
- wherein parts by mass are per 100 parts by mass of the styrene-modified polyphenylene ether compound.
A resin composition used for constituting a resin layer of a laminate in which the resin layer is provided on a metal layer surface, the resin composition comprising
- a styrene-modified polyphenylene ether compound obtained from reacting a polyphenylene ether compound with chloromethyl styrene;
- 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer;
- 0.1 parts by mass to 100 parts by mass of a component promoting solubility of the resin composition with a desmear solution, wherein the component is a polymer of diallyl phthalate;
- and
- 0.1 parts by mass to 30 parts by mass of 2,4-diphenyl-4-methyl-1-pentene as a curl lessening component,
- wherein parts by mass are per 100 parts by mass of the styrene-modified polyphenylene ether compound.
Dependencies are inferred from the claim text.