Wiring board and method for manufacturing same

A wiring board comprising:

• a non-magnetic conductor portion having conductivity,
• wherein the conductor portion comprises:
• a non-magnetic conductor base portion having conductivity, at least a part of the conductor base portion being made of conductive material;
• a non-magnetic intermediate layer disposed on a surface of the conductor base portion;
• a non-magnetic conductive layer made of conductive material and disposed on a surface of the intermediate layer;
• and
• a non-magnetic surface layer made of conductive material and disposed on a surface of the conductive layer,
• wherein the intermediate layer is a diffusion of a component of the conductor base portion and a component of the conductive layer,
• wherein the surface layer is provided with, on a surface thereof, a surface plated layer made of at least one of gold, silver and tin,
• wherein the conductor base portion contains a plurality of silica particles, and
• wherein the conductor base portion includes, on the surface thereof, a recessed portion formed by removing at least some of the plurality of silica particles from the surface of the conductor base portion.

A wiring board comprising:

• a non-magnetic conductor portion having conductivity,
• wherein the conductor portion comprises:
• a non-magnetic conductor base portion having conductivity, at least a part of the conductor base portion being made of conductive material;
• a non-magnetic intermediate layer disposed on a surface of the conductor base portion;
• a non-magnetic conductive layer made of conductive material and disposed on a surface of the intermediate layer;
• and
• a non-magnetic surface layer made of conductive material and disposed on a surface of the conductive layer,
• wherein the intermediate layer is a diffusion of a component of the conductor base portion and a component of the conductive layer,
• wherein the surface layer is provided with, on a surface thereof, a palladium plated layer,
• wherein the palladium plated layer is provided with, on a surface thereof, a surface plated layer made of at least one of gold, silver and tin,
• wherein the conductor base portion contains a plurality of silica particles, and
• wherein the conductor base portion includes, on the surface thereof, a recessed portion formed by removing at least some of the plurality of silica particles from the surface of the conductor base portion.