Heat sink module and manufacturing method thereof
AssigneeDelta Electronics, Inc.
InventorsChun-Yang Hung, Li-Kuang Tan
Life of this patent
Estimating the term…
Loading patent…
AssigneeDelta Electronics, Inc.
InventorsChun-Yang Hung, Li-Kuang Tan
Estimating the term…
In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.
A method of manufacturing heat sink module, comprising steps of:
Dependencies are inferred from the claim text.