Densely packed electronic systems

Abstract

A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm2 and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components in a circuit assembly. Switchable chips and redundant switchable chips may be included on each circuit assembly. Each independently operable cluster of components may include a power distribution chip, a test/monitor chip, and at least one redundant chip for each different logic device and for each different memory device. Chiplet components and combinations may be used to populate independently operable clusters of components. Agile reconfigurable systems are operable to adapt to changing workloads under direction of a system controller.

Dependencies are inferred from the claim text.