Low density microspheres
AssigneeTechnion Research & Development Foundation Limited
InventorsLev Vaikhanski, Yachin Cohen
Life of this patent
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Abstract
Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.
Claims10
A honeycomb comprising foam, said foam comprises expanded polymeric microspheres coated with a conductive additive, said polymeric microspheres being fused to each other in at least one portion thereof, said microspheres are limited to size variation of less than 15%, wherein said foam is characterized by a density below 15 kg/m3, wherein said density is characterized as being a uniform density, said uniform density being characterized as having at least 90% of said foam with densities that vary within a range of less than 15%, wherein said polymeric microspheres at least partially fill either one or both sides, and part, or all cells of said honeycomb, wherein said microspheres are coated with multiwall carbon nanotubes at said carbon nanotubes density of 1.5 gr/cc to 2.5 gr/cc.
Dependencies are inferred from the claim text.