Composite and multilayered silver films for joining electrical and mechanical components
AssigneeAlpha Assembly Solutions Inc.
InventorsOscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Abstract
A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.
Claims19
A silver film, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles wherein each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles, the reinforcing particles comprising glass and/or carbon and/or graphite particles, wherein the silver film is configured for die attachment by application of heat and pressure to sinter the silver film, and wherein the reinforcing silver foil layer is a metalized polymer or a ceramic foil comprising silver cladding.
Dependencies are inferred from the claim text.