Vapor phase deposition of organic films
AssigneeASM IP Holding B.V.
InventorsViljami J. Pore, Marko Tuominen, Hannu Huotari
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Abstract
Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.
Claims19
A method of forming an organic film, the method comprising:
- vaporizing a first reactant at a vaporizing temperature in a vaporizer to form a first reactant vapor;
- exposing a substrate in a reaction space to the first reactant vapor and a second reactant vapor, wherein the substrate is maintained at a temperature below about 130° C. during the exposing, wherein the temperature is between about 5° C. and about 50° C. below the vaporizing temperature during the exposing;
- and
- depositing a polyamic acid film from the first reactant vapor and the second reactant vapor on the substrate, wherein the polyamic acid film is mostly polyamic acid.
A method of forming an organic film, the method comprising:
- vaporizing a first reactant in a vaporizer to form a first reactant vapor;
- exposing a substrate in a reaction space to the first reactant vapor and a second reactant vapor, wherein the substrate is maintained at a temperature between about 100° C. and about 150° C. during the exposing;
- and
- depositing a polyamic acid film from the first reactant vapor and the second reactant vapor on the substrate, wherein the substrate comprises a topography with a three-dimensional structure, and wherein the depositing comprises preferentially depositing the polyamic acid film over lower features of the topography compared to higher features of the topography such that the polyamic acid film reduces an aspect ratio of the three-dimensional structure on the substrate as the polyamic acid film deposits.
An apparatus for film deposition, the apparatus comprising:
- a vessel configured for vaporizing a first reactant at a vaporizing temperature to form a first reactant vapor;
- a reaction space configured to accommodate a substrate;
- and
- a control system configured to cause the apparatus to perform a process, the process comprising:
- exposing the substrate in the reaction space to the first reactant vapor and a second reactant vapor, wherein the substrate is maintained at a temperature below about 130° C. during the exposing, wherein the temperature is between about 5° C. and about 50° C. below the vaporizing temperature during the exposing;
- and
- depositing a polyamic acid film from the first reactant vapor and the second reactant vapor on the substrate, wherein the polyamic acid film is mostly polyamic acid.
Dependencies are inferred from the claim text.